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Инструкция к Компьютеру Dell PowerEdge VRTX

Installing Server Module Components

Recommended Tools

You may need the following items to perform the procedures in this section:

• #1 and #2 Phillips screwdrivers

• T8 and T10 Torx drivers

• Wrist grounding strap

Installing And Removing A Server Module

NOTE: Server modules that are specifically configured for the PowerEdge VRTX enclosure, can be identified by a

label marked PCIe on the server module.

NOTE: Ensure that you have downloaded the latest BIOS on the server module(s) from dell.com/support.

Removing A Server Module

1. Remove the front bezel.

2. Power down the server module using the operating system commands or the CMC, and ensure that the server

module's power is off.

When a server module is powered off, its front-panel power indicator is off.

3. Press the release button on the server module handle.

4. Pull out the server module handle to unlock the server module from the enclosure.

CAUTION: If you are permanently removing the server module, install a server module blank(s). Operating the

system for extended periods of time without a server module blank installed can cause the enclosure to

overheat.

5. Slide the server module out of the enclosure.

CAUTION: To protect the I/O connector pins, install the I/O connector covers any time a server module is

removed from the enclosure.

6. Install the I/O connector cover over the I/O connector.

Figure 4. Removing and Installing the I/O Connector Cover

1. I/O connector cover

Figure 5. Removing and Installing a Server Module

1. release button

3. guide rail on server module (or server module

blank)

2. PCIe label on server module

4. guide rail on enclosure

NOTE: This label indicates that the

server module is configured specifically

5. server module handle

for the VRTX enclosure.

Installing A Server Module

1. If you are installing a new server module, remove the plastic cover from the I/O connector(s) and save for future

use.

2. Orient the server module so that the module handle is on the left side of the server module.

3. Slide the server module into the enclosure until the module release handle engages and locks the server module in

place.

4. Reinstall the front bezel.

Opening And Closing The Server Module

Opening The Server Module

CAUTION: Many repairs may only be done by a certified service technician. You should only perform

troubleshooting and simple repairs as authorized in your product documentation, or as directed by the online or

telephone service and support team. Damage due to servicing that is not authorized by Dell is not covered by your

warranty. Read and follow the safety instructions that came with the product.

NOTE: It is recommended that you always use a static mat and static strap while working on components in the

interior of the system.

1. Remove the server module from the enclosure.

2. Install the I/O connector cover.

3. Press the release button and slide the cover toward the back of the server module.

4. Carefully lift the cover away from the server module.

Figure 6. Opening and Closing the Server Module

1. I/O connector cover

2. server module cover

3. release button

4. cover alignment pins and notches

Closing The Server Module

1. Ensure that no tools or parts are left inside the server module.

2. Align the notches in the edges of the chassis with the cover alignment pins on the inner sides of the cover.

3. Lower the cover onto the chassis.

4. Slide the cover until it clicks into position.

A properly seated cover is flush with the surface of the chassis.

Inside The Server Module

Figure 7. Inside the Server Module

1. management riser card

8. memory modules (for processor 2)

2. mezzanine card 1/PCIe mezzanine card 1 - Fabric C

9. hard-drive/SSD backplane

3. mezzanine card 2/PCIe mezzanine card 2 - Fabric B

10. hard drives/SSDs (2)

4. network daughter card

11. processor 2 and heat sink

5. memory modules (for processor 1)

12. memory modules (for processor 2)

6. processor 1 and heat sink

13. memory modules (for processor 1)

7. cooling shroud

Cooling Shroud

The cooling shroud covers the memory modules and directs air flow in the system.

Removing The Cooling Shroud

CAUTION: Many repairs may only be done by a certified service technician. You should only perform

troubleshooting and simple repairs as authorized in your product documentation, or as directed by the online or

telephone service and support team. Damage due to servicing that is not authorized by Dell is not covered by your

warranty. Read and follow the safety instructions that came with the product.

CAUTION: Never operate your system with the cooling shroud removed. The system may get overheated quickly,

resulting in shutdown and loss of data.

1. Remove the server module from the enclosure.

2. Open the server module.

3. Hold the cooling shroud at both ends near the server module chassis and lift it up and away from the server

module.

Figure 8. Installing and Removing a Cooling Shroud

1. pins under the cooling shroud (2)

4. holes on the heat sink (2)

2. cooling shroud

5. slots on the chassis (4)

3. tabs (4)

Installing The Cooling Shroud

CAUTION: Many repairs may only be done by a certified service technician. You should only perform

troubleshooting and simple repairs as authorized in your product documentation, or as directed by the online or

telephone service and support team. Damage due to servicing that is not authorized by Dell is not covered by your

warranty. Read and follow the safety instructions that came with the product.

1. Position the tabs below the shroud to align with the holes on the heat sink installed on processor socket CPU1.

2. Lower the cooling shroud into the system until the tabs on the sides of the shroud engage with the slots on the

server module chassis and the pins under the shroud engage with the holes on the heat sink.

3. Close the server module.

4. Install the server module in the enclosure.

System Memory

Your system supports DDR3 unbuffered ECC DIMMs (UDIMM ECC) and registered DIMMs (RDIMMs). It supports DDR3

and DDR3L voltage specifications.

NOTE: MT/s indicates DIMM speed in MegaTransfers per second.

Memory bus operating frequency can be 1600 MT/s, 1333 MT/s, 1066 MT/s, or 800 MT/s depending on:

• DIMM type (UDIMM, RDIMM, or LRDIMM)

• DIMM configuration (number of ranks)

• maximum frequency of the DIMMs

• number of DIMMs populated per channel

• DIMM operating voltage

• system profile selected (for example, Performance Optimized, Custom, or Dense Configuration Optimized)

• maximum supported DIMM frequency of the processors

The system contains 24 memory sockets split into two sets of 12 sockets, one set per processor. Each 12-socket set is

organized into four channels. In each channel, the release levers of the first socket are marked white, the second socket

black, and the third socket green.

NOTE: DIMMs in sockets A1 to A12 are assigned to processor 1 and DIMMs in sockets B1 to B12 are assigned to

processor 2.

The following table shows the memory populations and operating frequencies for the supported configurations.

DIMM Type DIMMs Populated/

Operating Frequency (in MT/s) Maximum DIMM Rank/

Channel

1.5 V 1.35 V

UDIMM ECC 1 1333, 1066, and 800 1333, 1066, and 800 Dual rank

2 1333, 1066, and 800 1333, 1066, and 800 Dual rank

RDIMM 1

1600, 1333, 1066, and 800

1333, 1066, and 800

Dual rank

1333, 1066, and 800

1066 and 800

Quad rank

1600, 1333, 1066, and 800

1333, 1066, and 800

Dual rank

1066 and 800

Quad rank

3 1333, 1066, and 800 1066 and 800 Dual rank

LRDIMM 1 1333 and 1066 1333 and 1066 Quad rank

2 1333 and 1066 1333 and 1066 Quad rank

3 1066 1066 Quad rank

Figure 9. Memory Socket Locations

Memory channels are organized as follows:

Processor 1 channel 0: memory sockets A2, A6, and A10

channel 1: memory sockets A1, A5, and A9

channel 2: memory sockets A4, A8, and A12

channel 3: memory sockets A3, A7, and A11

Processor 2 channel 0: memory sockets B2, B6, and B10

channel 1: memory sockets B1, B5, and B9

channel 2: memory sockets B4, B8, and B12

channel 3: memory sockets B3, B7, and B11

General Memory Module Installation Guidelines

NOTE: Memory configurations that fail to observe these guidelines can prevent your system from starting and

producing any video output, hanging during memory configuration, or operating with reduced memory.

This system supports Flexible Memory Configuration, enabling the system to be configured and run in any valid chipset

architectural configuration. The following are the recommended guidelines for best performance:

• UDIMMs, RDIMMs, and LRDIMMs must not be mixed.

• x4 and x8 DRAM based DIMMs can be mixed. For more information, see Mode-Specific Guidelines.

• A maximum of two UDIMMs can be populated in a channel.

• Up to three LRDIMMs can be populated regardless of rank count.

• Up to two quad-rank RDIMMs and up to three dual- or single-rank RDIMMs can be populated per channel.

When a quad-rank RDIMM is populated in the first slot with white release levers, the third DIMM slot in the

channel with green release levers cannot be populated.

• Populate DIMM sockets only if a processor is installed. For single-processor systems, sockets A1 to A12 are

available. For dual-processor systems, sockets A1 to A12 and sockets B1 to B12 are available.

• Populate all sockets with white release tabs first, then black, and then green.

• Do not populate the third DIMM socket in a channel with green release tabs, if a quad-rank RDIMM is populated

in the first socket with white release tabs.

• Populate the sockets by highest rank count in the following order - first in sockets with white release levers,

then black, and then green. For example, if you want to mix quad-rank and dual-rank DIMMs, populate quad-

rank DIMMs in the sockets with white release tabs and dual-rank DIMMs in the sockets with black release tabs.

• In a dual-processor configuration, the memory configuration for each processor must be identical. For example,

if you populate socket A1 for processor 1, then populate socket B1 for processor 2, and so on.

• Memory modules of different sizes can be mixed provided that other memory population rules are followed (for

example, 2 GB and 4 GB memory modules can be mixed).

• Populate four DIMMs per processor (one DIMM per channel) at a time to maximize performance.

• If memory modules with different speeds are installed, they will operate at the speed of the slowest installed

memory module(s) or slower depending on system DIMM configuration.

• Populate DIMMs based on the following processor— heat sink configurations.

Table 1. Processor—Heat Sink Configuration

Processor

Heat Sink Number of DIMMs

Configuration

Type (in

Watts)

Maximum System Capacity Reliability, Availability, and

Serviceability (RAS) Features

Single processor up to 95 W 57 mm 12 12

Single processor 115 W or

77 mm 10 (Three DIMMs in

8 (Two DIMMs per channel)

130 W

channels 0 and 3 and two

DIMMs in channels 1 and 2)

Dual processor up to 95 W 57 mm 24 24

Dual processor 115 W or

77 mm 20 (Three DIMMs in

16 (Two DIMMs per channel)

130 W

channels 0 and 3 and two

DIMMs in channels 1 and 2)

NOTE: For optimal performance, your system may be configured with a larger heat sink than listed above.

Do not use any heat sink smaller than the configurations described above.

Mode-Specific Guidelines

Four memory channels are allocated to each processor. The allowable configurations depend on the memory mode

selected.

NOTE: x4 and x8 DRAM based DIMMs can be mixed providing support for RAS features. However, all guidelines for

specific RAS features must be followed. x4 DRAM based DIMMs retain Single Device Data Correction (SDDC) in

memory optimized (independent channel) mode. x8 DRAM based DIMMs require Advanced ECC mode to gain

SDDC.

The following sections provide additional slot population guidelines for each mode.

Advanced ECC (Lockstep)

Advanced ECC mode extends SDDC from x4 DRAM based DIMMs to both x4 and x8 DRAMs. This protects against single

DRAM chip failures during normal operation.

Memory installation guidelines:

• Memory modules must be identical in size, speed, and technology.

• DIMMs installed in memory sockets with white release tabs must be identical and similar rule applies for

sockets with black and green release tabs. This ensures that identical DIMMs are installed in matched pairs -

for example, A1 with A2, A3 with A4, A5 with A6, and so on.

NOTE: Advanced ECC with mirroring is not supported.

Memory Optimized (Independent Channel) Mode

This mode supports SDDC only for memory modules that use x4 device width and does not impose any specific slot

population requirements.

Memory Sparing

NOTE: To use memory sparing, this feature must be enabled in the System Setup.

In this mode, one rank per channel is reserved as a spare. If persistent correctable errors are detected on a rank, the

data from this rank is copied to the spare rank and the failed rank is disabled.

With memory sparing enabled, the system memory available to the operating system is reduced by one rank per

channel. For example, in a dual-processor configuration with sixteen 4 GB dual-rank DIMMs, the available system

memory is: 3/4 (ranks/channel) × 16 (DIMMs) × 4 GB = 48 GB, and not 16 (DIMMs) × 4 GB = 64 GB.

NOTE: Memory sparing does not offer protection against a multi-bit uncorrectable error.

NOTE: Both Advanced ECC/Lockstep and Optimizer modes support Memory Sparing.

Memory Mirroring

Memory Mirroring offers the strongest DIMM reliability mode compared to all other modes, providing improved

uncorrectable multi-bit failure protection. In a mirrored configuration, the total available system memory is one half of

the total installed physical memory. Half of the installed memory is used to mirror the active DIMMs. In the event of an

uncorrectable error, the system will switch over to the mirrored copy. This ensures SDDC and multi-bit protection.

Memory installation guidelines:

• Memory modules must be identical in size, speed, and technology.

• DIMMs installed in memory sockets with white release tabs must be identical and similar rule applies for

sockets with black and green release tabs. This ensures that identical DIMMs are installed in matched pairs -

for example, A1 with A2, A3 with A4, A5 with A6, and so on.

Sample Memory Configurations

The following tables show sample memory configurations that follow the appropriate memory guidelines stated in this

section.

NOTE: 16 GB quad-rank RDIMMs are not supported.

NOTE: 1R, 2R, and 4R in the following tables indicate single-, dual-, and quad-rank DIMMs respectively.

Table 2. Memory Configurations – Single Processor

System Capacity

DIMM Size (in

Number of

Organization and

DIMM Slot Population

(in GB)

GB)

DIMMs

Speed

2 2 1

1R x8, 1333 MT/s

1R x8, 1600 MT/s

4 2 2

1R x8, 1333 MT/s

A1, A3

1R x8, 1600 MT/s

8 2 4

1R x8, 1333 MT/s

A1, A2, A3, A4

1R x8, 1600 MT/s

12 2 6

1R x8, 1333 MT/s

A1, A2, A3, A4, A5, A6

1R x8, 1600 MT/s

16 2 8 1R x8, 1333 MT/s A1, A2, A3, A4, A5, A6, A7, A8

16 4 4

2R x8, 1333 MT/s

A1, A2, A3, A4

2R x8, 1600 MT/s

24 2 12 1R x8, 1333 MT/s A1, A2, A3, A4, A5, A6, A7, A8, A9, A10,

A11, A12

24 4 6

2R x8, 1333 MT/s

A1, A2, A3, A4, A5, A6

2R x8, 1600 MT/s

48 4 12 2R x8, 1333 MT/s A1, A2, A3, A4, A5, A6, A7, A8, A9, A10,

A11, A12

48 8 6

2R x4, 1333 MT/s

A1, A2, A3, A4, A5, A6

2R x4, 1600 MT/s

96 8 12 2R x4, 1333 MT/s A1, A2, A3, A4, A5, A6, A7, A8, A9, A10,

A11, A12

96 16 6

2R x4, 1333 MT/s

A1, A2, A3, A4, A5, A6

2R x4, 1600 MT/s

128 16 8

2R x4, 1333 MT/s

A1, A2, A3, A4, A5, A6, A7, A8

2R x4, 1600 MT/s

144 16 and 8 10 2R x4, 1333 MT/s

A1, A2, A3, A4, A5, A6, A7, A8, A9, A11

NOTE: 16 GB DIMMs must be

installed in the slots numbered

A1, A2, A3, A4, A5, A6, A7, and A8

and 8 GB DIMMs must be

installed in slots A9 and A11.

256 32 8 4R x4, 1333 MT/s A1, A2, A3, A4, A5, A6, A7, A8

384 32 12 4R x4, 1333 MT/s

A1, A2, A3, A4, A5, A6, A7, A8, A9, A10,

(LRDIMMs only)

A11, A12

Table 3. Memory Configurations – Two Processors

System Capacity (in

DIMM Size (in

Number of

Organization and

DIMM Slot Population

GB)

DIMMs

Speed

16 2 8

1R x8, 1333 MT/s

A1, A2, A3, A4, B1, B2, B3, B4

1R x8, 1600 MT/s

32 2 16 1R x8, 1333 MT/s A1, A2, A3, A4, A5, A6, A7, A8,

B1, B2, B3, B4, B5, B6, B7, B8

32 4 8

2R x8, 1333 MT/s

A1, A2, A3, A4, B1, B2, B3, B4

2R x8, 1600 MT/s

64 4 16 2R x8, 1333 MT/s A1, A2, A3, A4, A5, A6, A7, A8,

B1, B2, B3, B4, B5, B6, B7, B8

64 8 8

2R x4, 1333 MT/s

A1, A2, A3, A4, B1, B2, B3, B4

2R x4, 1600 MT/s

96 4 24 2R x8, 1333 MT/s A1, A2, A3, A4, A5, A6, A7, A8,

A9, A10, A11, A12, B1, B2, B3,

B4, B5, B6, B7, B8, B9, B10,

B11, B12

96 8 12

2R x8, 1333 MT/s

A1, A2, A3, A4, A5, A6, B1, B2,

2R x8, 1600 MT/s

B3, B4, B5, B6

128 8 16 2R x4, 1333 MT/s A1, A2, A3, A4, A5, A6, A7, A8,

B1, B2, B3, B4, B5, B6, B7, B8

128 16 8

2R x4, 1333 MT/s

A1, A2, A3, A4, B1, B2, B3, B4

2R x4, 1600 MT/s

160 8 20 2R x4, 1333 MT/s A1, A2, A3, A4, A5, A6, A7, A8,

A9, A11, B1, B2, B3, B4, B5,

B6, B7, B8, B9, B11

160 16 and 8 12

2R x4, 1333 MT/s

A1, A2, A3, A4, A5, A6, B1, B2,

B3, B4, B5, B6

2R x4, 1600 MT/s

NOTE: 16 GB DIMMs

must be installed in the

slots numbered A1, A2,

A3, A4, B1, B2, B3, and B4

and 8 GB DIMMs must be

installed in slots A5, A6,

B5 and B6.

192 8 24 2R x4, 1333 MT/s A1, A2, A3, A4, A5, A6, A7, A8,

A9, A10, A11, A12, B1, B2, B3,

B4, B5, B6, B7, B8, B9, B10,

B11, B12

192 16 12

2R x4, 1333 MT/s

A1, A2, A3, A4, A5, A6, B1, B2,

2R x4, 1600 MT/s

B3, B4, B5, B6

256 16 16

2R x4, 1333 MT/s

A1, A2, A3, A4, A5, A6, A7, A8,

2R x4, 1600 MT/s

B1, B2, B3, B4, B5, B6, B7, B8

System Capacity (in

DIMM Size (in

Number of

Organization and

DIMM Slot Population

GB)

DIMMs

Speed

384 16 24 2R x4, 1333 MT/s A1, A2, A3, A4, A5, A6, A7, A8,

A9, A10, A11, A12, B1, B2, B3,

B4, B5, B6, B7, B8, B9, B10,

B11, B12

512 32 16 4R x4, 1333 MT/s A1, A2, A3, A4, A5, A6, A7, A8,

B1, B2, B3, B4, B5, B6, B7, B8

768 32 24 4R x4, 1333 MT/s

A1, A2, A3, A4, A5, A6, A7, A8,

(LRDIMMs only)

A9, A10, A11, A12, B1, B2, B3,

B4, B5, B6, B7, B8, B9, B10,

B11, B12

Removing Memory Modules

WARNING: The DIMMs are hot to touch for some time after the server module has been powered down. Allow

time for the DIMMs to cool before handling them. Handle the DIMMs by the card edges and avoid touching the

DIMM components.

CAUTION: Many repairs may only be done by a certified service technician. You should only perform

troubleshooting and simple repairs as authorized in your product documentation, or as directed by the online or

telephone service and support team. Damage due to servicing that is not authorized by Dell is not covered by your

warranty. Read and follow the safety instructions that came with the product.

CAUTION: To ensure proper system cooling, memory-module blanks must be installed in any memory socket that is

not occupied. Remove memory-module blanks only if you intend to install memory in those sockets.

CAUTION: If you are permanently removing a processor, you must install a socket protective cap and a processor/

DIMM blank in the vacant socket to ensure proper system cooling. The processor/DIMM blank covers the vacant

sockets for the DIMMs and the processor.

1. Remove the server module from the enclosure.

2. Open the server module.

3. Remove the cooling shroud.

4. Locate the memory module socket(s).

CAUTION: Handle each memory module only on either card edge, making sure not to touch the middle of the

memory module.

5. Press down and out on the ejectors on each end of the socket until the memory module pops out of the socket.

6. Install the cooling shroud.

7. Close the server module.

8. Install the server module in the enclosure.

Figure 10. Installing and Removing a Memory Module or Memory Module Blank

1. memory module or memory blank

4. socket

2. edge connector

5. alignment key

3. ejectors (2)

Installing Memory Modules

WARNING: The memory modules are hot to the touch for some time after the system has been powered down.

Allow time for the memory modules to cool before handling them. Handle the memory modules by the card edges

and avoid touching the components on the memory module.