ASRock h81m: Chapter 4 UEFI SETUP UTILITY

Chapter 4 UEFI SETUP UTILITY

4.1 Introduction

ASRock Interactive UEFI is a blend of system conguration tools, cool sound eects

and stunning visuals. Not only will it make BIOS setup less dicult but also a lot

more amusing. is section explains how to use the UEFI SETUP UTILITY to

congure your system. You may run the UEFI SETUP UTILITY by pressing <F2>

or <Del> right aer you power on the computer, otherwise, the Power-On-Self-Test

(POST) will continue with its test routines. If you wish to enter the UEFI SETUP

UTILITY aer POST, restart the system by pressing <Ctl> + <Alt> + <Delete>, or

by pressing the reset button on the system chassis. You may also restart by turning

the system o and then back on.

Because the UEFI soware is constantly being updated, the following UEFI setup

screens and descriptions are for reference purpose only, and they may not exactly

match what you see on your screen.

4.1.1 UEFI Menu Bar

e top of the screen has a menu bar with the following selections:

Main

For setting system time/date information

OC Tweaker

For overclocking congurations

Advanced

For advanced system congurations

Tool

Useful tools

H/W Monitor

Displays current hardware status

Boot

For conguring boot settings and boot priority

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Security

For security settings

Exit

Exit the current screen or the UEFI Setup Utility

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4.1.2 Navigation Keys

Use < > key or < > key to choose among the selections on the menu bar, and

use < > key or < > key to move the cursor up or down to select items, then

press <Enter> to get into the sub screen. You can also use the mouse to click your

required item.

Please check the following table for the descriptions of each navigation key.

Navigation Key(s) Description

+ / -

To change option for the selected items

<Tab>

Switch to next function

<PGUP>

Go to the previous page

<PGDN>

Go to the next page

<HOME>

Go to the top of the screen

<END>

Go to the bottom of the screen

<F1>

To display the General Help Screen

<F4>

Toggle sound on/o

<F7>

Discard changes and exit the SETUP UTILITY

<F9>

Load optimal default values for all the settings

<F10>

Save changes and exit the SETUP UTILITY

<F12>

Print screen

<ESC>

Jump to the Exit Screen or exit the current screen

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4.2 Main Screen

When you enter the UEFI SETUP UTILITY, the Main screen will appear and

display the system overview.

Active Page on Entry

Select the default page when entering the UEFI setup utility.

UEFI Guide

UEFI Guide is a quick tutorial for ASRock's UEFI setup Utility. You may abort the

tutorial by pressing "esc".

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4.3 OC Tweaker Screen

In the OC Tweaker screen, you can set up overclocking features.

Because the UEFI soware is constantly being updated, the following UEFI setup

screens and descriptions are for reference purpose only, and they may not exactly

match what you see on your screen.

CPU Conguration

CPU Ratio

e CPU speed is determined by the CPU Ratio multiplied with the BCLK.

Increasing the CPU Ratio will increase the internal CPU clock speed without

aecting the clock speed of other components.

Intel SpeedStep Technology

Intel SpeedStep technology allows processors to switch between multiple frequen-

cies and voltage points for better power saving and heat dissipation.

Intel Turbo Boost Technology

Intel Turbo Boost Technology enables the processor to run above its base operating

frequency when the operating system requests the highest performance state.

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Filter PLL Frequency

CPU BCLK Filter Frequency. Choose 1.6 for better overclocking capabilities.

Long Duration Power Limit

Congure Package Power Limit 1 in watts. When the limit is exceeded, the CPU

ratio will be lowered aer a period of time. A lower limit can protect the CPU and

save power, while a higher limit may improve performance.

Long Duration Maintained

Congure the period of time until the CPU ratio is lowered when the Long

Duration Power Limit is exceeded.

Short Duration Power Limit

Congure Package Power Limit 2 in watts. When the limit is exceeded, the CPU

ratio will be lowered immediately. A lower limit can protect the CPU and save

power, while a higher limit may improve performance.

Primary Plane Current Limit

Congure the current limit of the CPU under Turbo Mode in ampere. A lower

limit can protect the CPU and save power, while a higher limit may improve

performance.

GT Frequency

Congure the frequency of the integrated GPU.

GT Voltage Mode

Auto: For optimized settings.

Adaptive: Add voltage to the integrated GPU when the system is under heavy load.

Override: e voltage is xed.

GT Adaptive Voltage

Congure the xed voltage added to the integrated GPU.

GT Voltage Oset

Congure the voltage added to the integrated GPU when the system is under heavy

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load.

DRAM Timing Conguration

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Load XMP Setting

Load XMP settings to overclock the DDR3 memory and perform beyond standard

specications.

DRAM Reference Clock

Select Auto for optimized settings.

DRAM Frequency

If [Auto] is selected, the motherboard will detect the memory module(s) inserted

and assign the appropriate frequency automatically.

DRAM Conguration

DRAM Tweaker

Fine tune the DRAM settings by leaving marks in checkboxes. Click OK to conrm

and apply your new settings.

CAS# Latency (tCL)

e time between sending a column address to the memory and the beginning of the data

in response.

RAS# to CAS# Delay (tRCD)

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e number of clock cycles required between the opening of a row of memory and

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accessing columns within it.

Row Precharge Time (tRP)

e number of clock cycles required between the issuing of the precharge command

and opening the next row.

RAS# Active Time (tRAS)

e number of clock cycles required between a bank active command and issuing the

precharge command.

Command Rate (CR)

e delay between when a memory chip is selected and when the rst active command can

be issued.

Write Recovery Time (tWR)

e amount of delay that must elapse aer the completion of a valid write operation,

before an active bank can be precharged.

Refresh Cycle Time (tRFC)

e number of clocks from a Refresh command until the rst Activate command to

the same rank.

RAS to RAS Delay (tRRD)

e number of clocks between two rows activated in dierent banks of the same

rank.

Write to Read Delay (tWTR)

e number of clocks between the last valid write operation and the next read

command to the same internal bank.

Read to Precharge (tRTP)

e number of clocks that are inserted between a read command to a row pre-

charge command to the same rank.

Four Activate Window (tFAW)

e time window in which four activates are allowed the same rank.

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CAS Write Latency (tCWL)

Congure CAS Write Latency.

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tREFI

Congure refresh cycles at an average periodic interval.

tCKE

Congure the period of time the DDR3 initiates a minimum of one refresh

command internally once it enters Self-Refresh mode.

tRDRD

Congure between module read to read delay.

tRDRDDR

Congure between module read to read delay from dierent ranks.

tRDRDDD

Use this to change DRAM tRWSR Auto/Manual settings. e default is [Auto].

tWRRD

Congure between module write to read delay.

tWRRDDR

Congure between module write to read delay from dierent ranks.

tWRRDDD

Use this to change DRAM tRRSR Auto/Manual settings. e default is [Auto].

Congure between module write to read delay from dierent DIMMs.

tWRWR

Congure between module write to write delay.

tWRWRDR

Congure between module write to write delay from dierent ranks.

tWRWRDD

Congure between module write to write delay from dierent DIMMs.

tRDWR

Congure between module read to write delay.

tRDWRDR

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Congure between module read to write delay from dierent ranks.

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tRDWRDD

Congure between module read to write delay from dierent DIMMs.

RTL (CHA)

Congure round trip latency for channel A.

RTL (CHB)

Congure round trip latency for channel B.

IO-L (CHA)

Congure IO latency for channel A.

IO-L (CHB)

Congure IO latency for channel B.

ODT WR (CHA)

Congure the memory on die termination resistors' WR for channel A.

ODT WR (CHB)

Congure the memory on die termination resistors' WR for channel B.

ODT NOM (CHA)

Use this to change ODT (CHA) Auto/Manual settings. e default is [Auto].

ODT NOM (CHB)

Use this to change ODT (CHB) Auto/Manual settings. e default is [Auto].

Command Tri State

Enable for DRAM power saving.

MRC Fast Boot

Enable Memory Fast Boot to skip DRAM memory training for booting faster.

FIVR Conguration

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FIVR Switch Frequency Signature

Select whether to boost or lower the FIVR Switch Frequency.

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FIVR Switch Frequency Oset

Congure the percentage of frequency boost or deduction.

CPU Voltage Mode

Auto: For optimized settings.

Adaptive: Add voltage to the CPU when the system is under heavy load.

Override: e voltage is xed.

CPU Override Voltage

Congure the voltage added to the CPU when the system is under heavy load.

CPU Voltage Oset

Congure the dynamic CPU voltage added to the CPU.

CPU Cache Override Voltage

Add voltage to the CPU Cache when the system is under heavy load.

CPU Cache Voltage Oset

Congure the voltage for the CPU Cache. Setting the voltage higher may increase

system stability when overclocking.

System Agent Voltage Oset

Congure the voltage for the System Agent. Setting the voltage higher may increase

system stability when overclocking.

CPU Analog IO Voltage Oset

CPU I/O Analog Voltage.

CPU Digital IO Voltage Oset

CPU I/O Digital Voltage.

CPU Integrated VR Faults

Disable FIVR Faults to raise the threshold to trigger CPU over current protection

and over voltage protection for better overclocking capabilities.

CPU Integrated VR Eciency Mode

Enable FIVR Eciency Management for power saving. Disable for better

performance and overclocking capabilities.

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4.4.3 Storage Conguration

SATA Controller(s)

Enable/disable the SATA controllers.

SATA Mode Selection

IDE: For better compatibility.

AHCI: Supports new features that improve performance.

AHCI (Advanced Host Controller Interface) supports NCQ and other new

features

that will improve SATA disk performance but IDE mode does not have these advan-

tages.

SATA Aggressive Link Power Management

SATA Aggressive Link Power Management allows SATA devices to enter a low

power state during periods of inactivity to save power. It is only supported by AHCI

mode.

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Hard Disk S.M.A.R.T.

S.M.A.R.T stands for Self-Monitoring, Analysis, and Reporting Technology. It is a

monitoring system for computer hard disk drives to detect and report on various

indicators of reliability.

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4.4.4 Intel® Smart Connect Technology

®

Intel

Smart Connect Technology

®

Intel

Smart Connect Technology automatically updates your email and social

networks, such as Twitter, Facebook, etc. while the computer is in sleep mode.

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4.4.5 Super IO Conguration

Serial Port

Enable or disable the Serial port.

Serial Port Address

Select the address of the Serial port.

Infrared Port

Enable or disable the Infrared port.

Parallel Port

Enable or disable the Parallel port.

Change Settings

Select the address of the Parallel port.

Device Mode

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Select the device mode according to your connected device.

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4.4.6 ACPI Conguration

Suspend to RAM

Select disable for ACPI suspend type S1. It is recommended to select auto for ACPI

S3 power saving.

Check Ready Bit

Enable to enter the operating system aer S3 only when the hard disk is ready, this

is recommended for better system stability.

ACPI HPET Table

Enable the High Precision Event Timer for better performance and to pass WHQL

tests.

PS/2 Keyboard Power On

Allow the system to be waked up by a PS/2 Keyboard.

PCI Devices Power On

Allow the system to be waked up by a PCI device and enable wake on LAN.

Ring-In Power On

Allow the system to be waked up by onboard COM port modem Ring-In signals.

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RTC Alarm Power On

Allow the system to be waked up by the real time clock alarm. Set it to By OS to let

it be handled by your operating system.

USB Keyboard/Remote Power On

Allow the system to be waked up by an USB keyboard or remote controller.

USB Mouse Power On

Allow the system to be waked up by an USB mouse.

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4.4.7 USB Conguration

USB Controller

Enable or disable all the USB 2.0 ports.

USB 3.0 Controller

Enable or disable all the USB 3.0 ports.

Legacy USB Support

Enable or disable Legacy OS Support for USB 2.0 devices. If you encounter USB

compatibility issues it is recommended to disable legacy USB support. Select UEFI

Setup Only to support USB devices under the UEFI setup and Windows/Linux

operating systems only.

Legacy USB 3.0 Support

Enable or disable Legacy OS Support for USB 3.0 devices.

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4.4.8 Trusted Computing

Security Device Support

Enable to activate Trusted Platform Module (TPM) security for your hard disk

drives.

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4.5 Tools

UEFI Tech Service

Contact ASRock Tech Service if you are having trouble with your PC. Please setup

network conguration before using UEFI Tech Service.

Easy Driver Installer

For users that don’t have an optical disk drive to install the drivers from our support

CD, Easy Driver Installer is a handy tool in the UEFI that installs the LAN driver

to your system via an USB storage device, then downloads and installs the other

required drivers automatically.

Instant Flash

Save UEFI les in your USB storage device and run Instant Flash to update your

UEFI.

Internet Flash

ASRock Internet Flash downloads and updates the latest UEFI rmware version

from our servers for you. Please setup network conguration before using Internet

Flash.

*For BIOS backup and recovery purpose, it is recommended to plug in your USB

pen drive before using this function.

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Network Conguration

Use this to congure internet connection settings for Internet Flash.

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Internet Setting

Enable or disable sound eects in the setup utility.

UEFI Download Server

Select a server to download the UEFI rmware.

Dehumidier Function

If Dehumidier Function is enabled, the computer will power on automatically to

dehumidify the system aer entering S4/S5 state.

Dehumidier Period

Congure the period of time until the computer powers on and enables

Dehumidier aer entering S4/S5 state.

Dehumidier Duration

Congure the duration of the dehumidifying process before it returns to S4/S5

state.

Dehumidier CPU Fan Setting

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Congure the speed of the CPU fan while Dehumidier is enabled. e higher the

value, the faster the fan speed.

Max: 255

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Min: 1

Save User Default

Type a prole name and press enter to save your settings as user default.

Load User Default

Load previously saved user defaults.

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Contact Information

If you need to contact ASRock or want to know more about ASRock, you’re welcome

to visit ASRock’s website at http://www.asrock.com; or you may contact your dealer

for further information. For technical questions, please submit a support request

form at http://www.asrock.com/support/tsd.asp

ASRock Incorporation

2F., No.37, Sec. 2, Jhongyang S. Rd., Beitou District,

Taipei City 112, Taiwan (R.O.C.)

ASRock EUROPE B.V.

Bijsterhuizen 3151

6604 LV Wijchen

e Netherlands

Phone: +31-24-345-44-33

Fax: +31-24-345-44-38

ASRock America, Inc.

13848 Magnolia Ave, Chino, CA91710

U.S.A.

Phone: +1-909-590-8308

Fax: +1-909-590-1026

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