MSI b85m-p32: инструкция

Раздел: Компьютерная техника, комплектующие, аксессуары

Тип: Материнская Плата

Характеристики, спецификации

Информация о производителе:
Производитель:
Micro-Star Int'l CO., Ltd.
Страна производства:
КИТАЙ

Инструкция к Материнской Плате MSI b85m-p32

Copyright Notice

The material in this document is the intellectual property of MICRO-STAR

INTERNATIONAL. We take every care in the preparation of this document, but no

guarantee is given as to the correctness of its contents. Our products are under

continual improvement and we reserve the right to make changes without notice.

Preface

Trademarks

All trademarks in this manual are properties of their respective owners.

®

MSI

is registered trademark of Micro-Star Int’l Co.,Ltd.

®

NVIDIA

is registered trademark of NVIDIA Corporation.

®

ATI

is registered trademark of AMD Corporation.

®

AMD

is registered trademarks of AMD Corporation.

®

Intel

is registered trademarks of Intel Corporation.

®

Windows

is registered trademarks of Microsoft Corporation.

®

AMI

is registered trademark of American Megatrends Inc.

®

Award

is a registered trademark of Phoenix Technologies Ltd.

®

Sound Blaster

is registered trademark of Creative Technology Ltd.

®

Realtek

is registered trademark of Realtek Semiconductor Corporation.

®

JMicron

is registered trademark of JMicron Technology Corporation.

®

Netware

is registered trademark of Novell, Inc.

®

Lucid

is trademark of LucidLogix Technologies, Ltd.

®

VIA

is registered trademark of VIA Technologies, Inc.

®

ASMedia

is registered trademark of ASMedia Technology Inc.

iPad, iPhone, and iPod are trademarks of Apple Inc.

Qualcomm Atheros and Killer are trademarks of Qualcomm Atheros Inc.

Revision History

Revision Revision History Date

V.0

First release 203/06

Add CSM-B85M-P32, CSM-H8M-P32 and

V.

203/

H8M-P32L

G52-7846X7

Safety Instructions

Preface

Always read the safety instructions carefully.

Keep this User’s Manual for future reference.

Keep this equipment away from humidity.

Lay this equipment on a reliable 󰘱at surface before setting it up.

The openings on the enclosure are for air convection hence protects the

equipment from overheating. DO NOT COVER THE OPENINGS.

Make sure the voltage of the power source is at 0/220V before connecting the

equipment to the power inlet.

Place the power cord such a way that people can not step on it. Do not place

anything over the power cord.

Always Unplug the Power Cord before inserting any add-on card or module.

All cautions and warnings on the equipment should be noted.

Never pour any liquid into the opening that can cause damage or cause electrical

shock.

If any of the following situations arises, get the equipment checked by service

personnel:

The power cord or plug is damaged.

Liquid has penetrated into the equipment.

The equipment has been exposed to moisture.

The equipment does not work well or you can not get it work according to

User’s Manual.

The equipment has been dropped and damaged.

The equipment has obvious sign of breakage.

o

DO NOT LEAVE THIS EQUIPMENT IN AN ENVIRONMENT ABOVE 60

C

o

(40

F), IT MAY DAMAGE THE EQUIPMENT.

Battery Information

European Union:

Batteries, battery packs, and accumulators should not be disposed

of as unsorted household waste. Please use the public collection

system to return, recycle, or treat them in compliance with the local

regulations.

Taiwan:

For better environmental protection, waste batteries should be

collected separately for recycling or special disposal.

廢電池請回收

California, USA:

The button cell battery may contain perchlorate material and requires

special handling when recycled or disposed of in California.

For further information please visit:

http://www.dtsc.ca.gov/hazardouswaste/perchlorate/

CAUTION: There is a risk of explosion, if battery is incorrectly replaced.

Replace only with the same or equivalent type recommended by the manufacturer.

2

FCC-B Radio Frequency Interference Statement

This equipment has been tested and found to comply with the limits for a Class

B digital device, pursuant to Part 5 of the FCC Rules. These limits are designed

to provide reasonable protection against harmful interference in a residential

installation. This equipment generates, uses and can radiate radio frequency

Preface

energy and, if not installed and used in accordance with the instructions, may cause

harmful interference to radio communications. However, there is no guarantee that

interference will not occur in a particular installation. If this equipment does cause

harmful interference to radio or television reception, which can be determined

by turning the equipment o󰘯 and on, the user is encouraged to try to correct the

interference by one or more of the measures listed below.

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.

Connect the equipment into an outlet on a circuit di󰘯erent from that to which

the receiver is connected.

Consult the dealer or an experienced radio/television technician for help.

Notice 

The changes or modi󰘰cations not expressly approved by the party responsible for

compliance could void the user’s authority to operate the equipment.

Notice 2

Shielded interface cables and A.C. power cord, if any, must be used in order to

comply with the emission limits.

VOIR LA NOTICE D’INSTALLATION AVANT DE RACCORDER AU RESEAU.

Micro-Star International

MS-7846

This device complies with Part 5 of the FCC Rules. Operation is subject to the

following two conditions:

)

this device may not cause harmful interference, and

2)

this device must accept any interference received, including interference that

may cause undesired operation.

CE Conformity

Hereby, Micro-Star International CO., LTD declares that this device is

in compliance with the essential safety requirements and other relevant

provisions set out in the European Directive.

3

Radiation Exposure Statement

Preface

This equipment complies with FCC radiation exposure limits set forth for an

uncontrolled environment. This equipment and its antenna should be installed and

operated with minimum distance 20 cm between the radiator and your body. This

equipment and its antenna must not be co-located or operating in conjunction with

any other antenna or transmitter.

European Community Compliance Statement

The equipment complies with the RF Exposure Requirement 999/59/EC, Council

Recommendation of 2 July 999 on the limitation of exposure of the general public

to electromagnetic 󰘰elds (0–300GHz). This wireless device complies with the R&TTE

Directive.

Taiwan Wireless Statements

無線設備警告聲明

經型式認證合格之低功率射頻電機,非經許可,公司、商號或使用者均不得擅自變更

頻率、加大功率或變更原設計之特性及功能。

低功率射頻電機之使用不得影響飛航安全及干擾合法通信;經發現有干擾現象時,應

立即停用,並改善至無干擾時方得繼續使用。前項合法通信,指依電信法規定作業之

無線電通信。低功率射頻電機須忍受合法通信或工業、科學及醫療用電波輻射性電機

設備之干擾。

警告使用者:這是甲類資訊產品,在居住的環境中使用時,可能會造成無線電干擾,在

這種情況下,使用者會被要求採取某些適當的對策。

Japan VCCI Class B Statement

クラス B 情報技術装置

この装置は、情報技術装置等電波障害自主規制協議会(VCCI)の基準に基づくクラ

スB情報技術装置です。この装置が家庭内でラジオやテレビジョン受信機に近接して

使われると、受信障害を引き起こすことがあります。取扱説明書にしたがって正し

い取り扱いをしてください。

Korea Warning Statements

당해 무선설비는 운용중 전파혼신 가능성이 있음

Chemical Substances Information

In compliance with chemical substances regulations, such as the EU REACH

Regulation (Regulation EC No. 907/2006 of the European Parliament and the

Council), MSI provides the information of chemical substances in products at:

http://www.msi.com/html/popup/csr/evmtprtt_pcm.html

4

产品中有毒有害物质或元素名称及含量

根据中国<电子信息产品污染控制管理办法>

有毒有害物质或元素

Preface

部件名称

六价铬

多溴联苯

多溴二苯醚

(Pb)

(Hg)

(Cd)

(Cr6+)

(PBB)

(PBDE)

印刷电路板组件*

电池**

外部信号连接头

线材

〇: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T363-2006标

准规定的限量要求下。

☓: 表示该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T363-

2006标准规定的限量要求,但所有部件都符合欧盟RoHS要求。

* 印刷电路板组件: 包括印刷电路板及其构成的零部件。

** 电池本体上如有环保使用期限标识,以本体标识为主。

上述有毒有害物质或元素清单会依型号之部件差异而有所增减。

產品部件本体上如有环保使用期限标识,以本体标识为主。

5

WEEE Statement

Preface

WEEE (Waste Electrical and Electronic Equipment)

ENGLISH

To protect the global environment and as an environmentalist, MSI must

remind you that...

Under the European Union (“EU”) Directive on Waste Electrical and

Electronic Equipment, Directive 2002/96/EC, which takes e󰘯ect on August 3, 2005,

products of “electrical and electronic equipment” cannot be discarded as municipal

wastes anymore, and manufacturers of covered electronic equipment will be

obligated to take back such products at the end of their useful life. MSI will comply

with the product take back requirements at the end of life of MSI-branded products

that are sold into the EU. You can return these products to local collection points.

DEUTSCH

Hinweis von MSI zur Erhaltung und Schutz unserer Umwelt

Gemäß der Richtlinie 2002/96/EG über Elektro- und Elektronik-Altgeräte dürfen

Elektro- und Elektronik-Altgeräte nicht mehr als kommunale Abfälle entsorgt werden.

MSI hat europaweit verschiedene Sammel- und Recyclingunternehmen beauftragt,

die in die Europäische Union in Verkehr gebrachten Produkte, am Ende seines

Lebenszyklus zurückzunehmen. Bitte entsorgen Sie dieses Produkt zum gegebenen

Zeitpunkt ausschliesslich an einer lokalen Altgerätesammelstelle in Ihrer Nähe.

FRANÇAIS

En tant qu’écologiste et a󰘰n de protéger l’environnement, MSI tient à rappeler ceci...

Au sujet de la directive européenne (EU) relative aux déchets des équipement

électriques et électroniques, directive 2002/96/EC, prenant e󰘯et le 3 août 2005,

que les produits électriques et électroniques ne peuvent être déposés dans les

décharges ou tout simplement mis à la poubelle. Les fabricants de ces équipements

seront obligés de récupérer certains produits en 󰘰n de vie. MSI prendra en compte

cette exigence relative au retour des produits en 󰘰n de vie au sein de la communauté

européenne. Par conséquent vous pouvez retourner localement ces matériels dans

les points de collecte.

РУССКИЙ

Компания MSI предпринимает активные действия по защите окружающей

среды, поэтому напоминаем вам, что....

В соответствии с директивой Европейского Союза (ЕС) по предотвращению

загрязнения окружающей среды использованным электрическим и электронным

оборудованием (директива WEEE 2002/96/EC), вступающей в силу 3

августа 2005 года, изделия, относящиеся к электрическому и электронному

оборудованию, не могут рассматриваться как бытовой мусор, поэтому

производители вышеперечисленного электронного оборудования обязаны

принимать его для переработки по окончании срока службы. MSI обязуется

соблюдать требования по приему продукции, проданной под маркой MSI на

территории EC, в переработку по окончании срока службы. Вы можете вернуть

эти изделия в специализированные пункты приема.

6

ESPAÑOL

MSI como empresa comprometida con la protección del medio ambiente,

recomienda:

Bajo la directiva 2002/96/EC de la Unión Europea en materia de desechos y/o

equipos electrónicos, con fecha de rigor desde el 3 de agosto de 2005, los

Preface

productos clasi󰘰cados como “eléctricos y equipos electrónicos” no pueden ser

depositados en los contenedores habituales de su municipio, los fabricantes de

equipos electrónicos, están obligados a hacerse cargo de dichos productos al

termino de su período de vida. MSI estará comprometido con los términos de

recogida de sus productos vendidos en la Unión Europea al 󰘰nal de su periodo de

vida. Usted debe depositar estos productos en el punto limpio establecido por el

ayuntamiento de su localidad o entregar a una empresa autorizada para la recogida

de estos residuos.

NEDERLANDS

Om het milieu te beschermen, wil MSI u eraan herinneren dat….

De richtlijn van de Europese Unie (EU) met betrekking tot Vervuiling van Electrische

en Electronische producten (2002/96/EC), die op 3 Augustus 2005 in zal gaan

kunnen niet meer beschouwd worden als vervuiling. Fabrikanten van dit soort

producten worden verplicht om producten retour te nemen aan het eind van hun

levenscyclus. MSI zal overeenkomstig de richtlijn handelen voor de producten

die de merknaam MSI dragen en verkocht zijn in de EU. Deze goederen kunnen

geretourneerd worden op lokale inzamelingspunten.

SRPSKI

Da bi zaštitili prirodnu sredinu, i kao preduzeće koje vodi računa o okolini i prirodnoj

sredini, MSI mora da vas podesti da…

Po Direktivi Evropske unije (“EU”) o odbačenoj ekektronskoj i električnoj opremi,

Direktiva 2002/96/EC, koja stupa na snagu od 3. Avgusta 2005, proizvodi koji

spadaju pod “elektronsku i električnu opremu” ne mogu više biti odbačeni kao običan

otpad i proizvođači ove opreme biće prinuđeni da uzmu natrag ove proizvode na

kraju njihovog uobičajenog veka trajanja. MSI će poštovati zahtev o preuzimanju

ovakvih proizvoda kojima je istekao vek trajanja, koji imaju MSI oznaku i koji su

prodati u EU. Ove proizvode možete vratiti na lokalnim mestima za prikupljanje.

POLSKI

Aby chronić nasze środowisko naturalne oraz jako 󰘰rma dbająca o ekologię, MSI

przypomina, że...

Zgodnie z Dyrektywą Unii Europejskiej (“UE”) dotyczącą odpadów produktów

elektrycznych i elektronicznych (Dyrektywa 2002/96/EC), która wchodzi w życie 3

sierpnia 2005, tzw. “produkty oraz wyposażenie elektryczne i elektroniczne “ nie

mogą być traktowane jako śmieci komunalne, tak więc producenci tych produktów

będą zobowiązani do odbierania ich w momencie gdy produkt jest wycofywany z

użycia. MSI wypełni wymagania UE, przyjmując produkty (sprzedawane na terenie

Unii Europejskiej) wycofywane z użycia. Produkty MSI będzie można zwracać w

wyznaczonych punktach zbiorczych.

7

TÜRKÇE

Preface

Çevreci özelliğiyle bilinen MSI dünyada çevreyi korumak için hatırlatır:

Avrupa Birliği (AB) Kararnamesi Elektrik ve Elektronik Malzeme Atığı, 2002/96/EC

Kararnamesi altında 3 Ağustos 2005 tarihinden itibaren geçerli olmak üzere,

elektrikli ve elektronik malzemeler diğer atıklar gibi çöpe atılamayacak ve bu

elektonik cihazların üreticileri, cihazların kullanım süreleri bittikten sonra ürünleri geri

toplamakla yükümlü olacaktır. Avrupa Birliği’ne satılan MSI markalı ürünlerin kullanım

süreleri bittiğinde MSI ürünlerin geri alınması isteği ile işbirliği içerisinde olacaktır.

Ürünlerinizi yerel toplama noktalarına bırakabilirsiniz.

ČESKY

Záleží nám na ochraně životního prostředí - společnost MSI upozorňuje...

Podle směrnice Evropské unie (“EU”) o likvidaci elektrických a elektronických

výrobků 2002/96/EC platné od 3. srpna 2005 je zakázáno likvidovat “elektrické

a elektronické výrobky” v běžném komunálním odpadu a výrobci elektronických

výrobků, na které se tato směrnice vztahuje, budou povinni odebírat takové výrobky

zpět po skončení jejich životnosti. Společnost MSI splní požadavky na odebírání

výrobků značky MSI, prodávaných v zemích EU, po skončení jejich životnosti. Tyto

výrobky můžete odevzdat v místních sběrnách.

MAGYAR

Annak érdekében, hogy környezetünket megvédjük, illetve környezetvédőként

fellépve az MSI emlékezteti Önt, hogy ...

Az Európai Unió („EU”) 2005. augusztus 3-án hatályba lépő, az elektromos

és elektronikus berendezések hulladékairól szóló 2002/96/EK irányelve szerint

az elektromos és elektronikus berendezések többé nem kezelhetőek lakossági

hulladékként, és az ilyen elektronikus berendezések gyártói kötelessé válnak az

ilyen termékek visszavételére azok hasznos élettartama végén. Az MSI betartja

a termékvisszavétellel kapcsolatos követelményeket az MSI márkanév alatt az

EU-n belül értékesített termékek esetében, azok élettartamának végén. Az ilyen

termékeket a legközelebbi gyűjtőhelyre viheti.

ITALIANO

Per proteggere l’ambiente, MSI, da sempre amica della natura, ti ricorda che….

In base alla Direttiva dell’Unione Europea (EU) sullo Smaltimento dei Materiali

Elettrici ed Elettronici, Direttiva 2002/96/EC in vigore dal 3 Agosto 2005, prodotti

appartenenti alla categoria dei Materiali Elettrici ed Elettronici non possono più

essere eliminati come ri󰘰uti municipali: i produttori di detti materiali saranno obbligati

a ritirare ogni prodotto alla 󰘰ne del suo ciclo di vita. MSI si adeguerà a tale Direttiva

ritirando tutti i prodotti marchiati MSI che sono stati venduti all’interno dell’Unione

Europea alla 󰘰ne del loro ciclo di vita. È possibile portare i prodotti nel più vicino

punto di raccolta

8

Contents

English ......................................................................................

Motherboard Speci󰘰cations ....................................................................................2

Optional Speci󰘰cations ...........................................................................................4

Preface

Back Panel ..............................................................................................................5

CPU & Heatsink Installation ....................................................................................6

Memory Installation .................................................................................................8

Internal Connectors.................................................................................................9

BIOS Setup .............................................................................................................26

한국어 .......................................................................................33

메인보드 사양 .........................................................................................................34

옵션 사양 .................................................................................................................36

후면 패널 .................................................................................................................37

CPU 및 히트싱크 설치 ............................................................................................38

메모리 설치 .............................................................................................................40

내장 커넥터 .............................................................................................................4

BIOS 설정 ...............................................................................................................48

Français ....................................................................................55

Spéci󰘰cations ..........................................................................................................56

Spéci󰘰cations en option ..........................................................................................58

Panneau Arrière ......................................................................................................59

Installation du CPU et son ventilateur .....................................................................60

Installation de mémoire ...........................................................................................62

Connecteurs internes ..............................................................................................63

Con󰘰guration BIOS .................................................................................................70

Deutsch ....................................................................................77

Spezi󰘰kationen........................................................................................................78

Optionale Spezi󰘰kationen .......................................................................................80

Rücktafel-Übersicht.................................................................................................8

CPU & Kühlkörper Einbau ......................................................................................82

Speicher ..................................................................................................................84

Interne Anschlüsse .................................................................................................85

BIOS Setup .............................................................................................................92

9

Русский ....................................................................................99

Preface

Характеристики системной платы .....................................................................00

Дополнительные характеристики ......................................................................02

Задняя панель .....................................................................................................03

Установка ЦП и радиатора .................................................................................04

Установка памяти ................................................................................................06

Внутренние разъемы ..........................................................................................07

Настройка BIOS ...................................................................................................4

简体中文 .................................................................................2

主板规格 ................................................................................................................22

选配规格 ................................................................................................................24

后置面板 ................................................................................................................25

CPU & 风扇安装 ....................................................................................................26

内存安装 ................................................................................................................28

内部接口 ................................................................................................................29

BIOS Setup ...........................................................................................................36

繁體中文 .................................................................................43

主機板規格 ............................................................................................................44

各型號搭載規格對應表 ..........................................................................................46

背板快速指南 ........................................................................................................47

安裝 CPU 與散熱風扇 ...........................................................................................48

安裝記憶體 ............................................................................................................50

內建接頭 ................................................................................................................5

BIOS 設定 .............................................................................................................58

日本語 .....................................................................................65

マザーボードの仕様 ..............................................................................................66

オプションの仕様 .................................................................................................68

I/Oパネル ..............................................................................................................69

CPUおよびヒートシンクの装着 ...........................................................................70

メモリの装着 ........................................................................................................72

内部コネクター .....................................................................................................73

BIOSの設定 ...........................................................................................................80

0

English

Thank you for choosing the CSM-B85M-P32/ CSM-H8M-P32/ H8M-P32L/ H87M-

P32/ B85M-P32/ H8M-P32 Series (MS-7846 v.X) Micro-ATX motherboard. These

motherboards are based on Intel H8/ B85/ H87 chipset for optimal system e󰘲ciency.

Designed to 󰘰t the advanced Intel LGA50 processor. These motherboards deliver

a high performance and professional desktop platform solution.

Layout

English



Top : mouse

Bottom:keyboard

CPUFAN

2

JPWR2

AN

SYSF

Top :

Parallel Port

Bottom:

COM portA

VGA port

JPWR1

USB3.0 ports

JUSB_PW1

Top: LAN Jack

Bottom: USB2.0 ports

DIMM1

DIMM2

optional)

T:Line-In

SYSFAN1

T1

M:Line- Out

BA

SB3

U

B:Mic-In

J (

PCI_E1

PCI_E2

PCI1

optional)

JBAT1

JCI1

SB3

SATA1

SATA4

U

J (

PCI2

JAUD1

JUSB2JFP1

JUSB1

SATA2

SATA3

JFP2

JUSB_PW2

JCOM2

JTPM1

Motherboard Speci󰘰cations

®

CPU

4th Generation Intel

Core™ i7 / Core™ i5 / Core™ i3 /

Support

®

®

Pentium

/ Celeron

processors for LGA 50 socket

®

Chipset Intel

H8/ B85/ H87 Express Chipset

English

Memory

2x DDR3 memory slots supporting up to 32GB

Support

Supports DDR3 600/ 333/ 066 MHz

Dual channel memory architecture

Supports non-ECC, un-bu󰘯ered memory

Expansion

x PCIe x6 slot (optional)

Slots

x PCIe 2.0 x slot

Onboard

x VGA port, supporting a maximum resolution of 920x200

Graphics

@ 60Hz, 24bpp

Storage Intel H8/ B85/ H87 Express Chipset

-

4x SATA ports (optional)

-

Supports RAID 0, RAID, RAID 5 and RAID 0 (optional)

-

Supports Intel Smart Response Technology (optional)*

-

Supports Intel Rapid Start Technology (optional)*

-

Supports Intel Smart Connect Technology

* Supports Intel Core processors on Windows 7 and Windows 8

USB Intel H8/ B85/ H87 Express Chipset

-

4x USB 3.0 ports (2 ports on the back panel, 2 ports

available through the internal USB connector*)

-

6x USB 2.0 ports (2 ports on the back panel, 4 ports

available through the internal USB connectors)

* H8M-P32 uses NEC uPD720202 USB 3.0 controller for the

internal USB 3.0 connector.

®

Audio Realtek

ALC887 Codec

®

LAN Realtek

RTL8G Gigabit LAN controller

Back Panel

x PS/2 keyboard port

Connectors

x PS/2 mouse port

x Parallel port

x Serial port

x VGA port

2x USB 2.0 ports

2x USB 3.0 ports

x LAN (RJ45) port

3x audio jacks

2

Internal

x 24-pin ATX main power connector

Connectors

x 4-pin ATX 2V power connector

4x SATA connectors

2x USB 2.0 connectors (supports additional 4 USB 2.0 ports)

x USB 3.0 connector (supports additional 2 USB 3.0 ports)

(optional)

x 4-pin CPU fan connector

x 4-pin system fan connector

x 3-pin system fan connector

English

x Front panel audio connector

x Serial port connector

x TPM connector

2x System panel connectors

x Chassis Intrusion connector

x Clear CMOS jumper

2x USB power jumpers

BIOS

UEFI AMI BIOS

Features

ACPI 5.0, PnP .0a, SM BIOS 2.7, DMI 2.0

Multi-language

Form Factor Micro-ATX Form Factor

9.6 in. x 9.0 in. (24.4 cm x 22.8 cm)

For the latest information about CPU, please visit

http://www.msi.com/service/cpu-support/

For more information on compatible components, please

visit http://www.msi.com/service/test-report/

3

Optional Speci󰘰cations

Name

H87M-P32 B85M-P32 H8M-P32

Speci󰘰cation

English

PCIe x6 slot Gen3 Gen3 Gen2

SATA, SATA2 SATA 6Gb/s SATA 6Gb/s SATA 6Gb/s

SATA3, SATA4 SATA 6Gb/s SATA 3Gb/s SATA 3Gb/s

Front USB3.0

BIOS ROM 28Mb 28Mb 64Mb

RAID Supported Not supported Not supported

Small Business

Supported Supported Not supported

Advantage

Intel Rapid Start Supported Supported Not supported

Intel Smart Response Supported Not supported Not supported

Intel Smart Connect Supported Supported Supported

Name

CSM-B85M-P32 CSM-H8M-P32 H8M-P32L

Speci󰘰cation

PCIe x6 slot Gen3 Gen2 Gen2

SATA, SATA2 SATA 6Gb/s SATA 6Gb/s SATA 6Gb/s

SATA3, SATA4 SATA 3Gb/s SATA 3Gb/s SATA 3Gb/s

Front USB3.0

BIOS ROM 28Mb 64Mb 64Mb

RAID Not supported Not supported Not supported

Small Business

Supported Not supported Not supported

Advantage

Intel Rapid Start Supported Not supported Not supported

Intel Smart Response Not supported Not supported Not supported

Intel Smart Connect Supported Supported Supported

4

Back Panel

Parallel

LAN

PS/2 Mouse

USB 3.0

English

PS/2 Keyboard USB 2.0

Serial Audio

VGA

LAN LED Indicator

LINK/ACT

SPEED

LED

LED

LED LED Status Description

O󰘯 No link

Link/ Activity LED

Yellow Linked

Blinking Data activity

O󰘯 0 Mbps connection

Speed LED

Green 00 Mbps connection

Orange  Gbps connection

Audio 2, 4, 6 or 8-channel con󰘰guration

Port 2-channel 4-channel 6-channel 8-channel

Blue Line in RS-Out RS-Out RS-Out

Green Line out FS-Out FS-Out FS-Out

Pink Mic Mic CS-Out CS-Out

Front audio - - - SS-Out

5

CPU & Heatsink Installation

When installing a CPU, always remember to install a CPU heatsink. A CPU heatsink

is necessary to prevent overheating and maintain system stability. Follow the steps

below to ensure correct CPU and heatsink installation. Wrong installation can

damage both the CPU and the motherboard.

English

Video Demonstration

Watch the video to learn how to install CPU & heatsink. at the

address below.

http://youtu.be/bf5La099urI

. Push the load lever down to unclip it and lift to the fully open position.

2. The load plate will automatically lift up as the load lever is pushed to the fully

open position.

Important

Do not touch the socket contacts or the bottom of the CPU.

3. Align the notches with the socket alignment keys. Lower the CPU straight down,

without tilting or sliding the CPU in the socket. Inspect the CPU to check if it is

properly seated in the socket.

4. Close and slide the load plate under the retention knob. Close and engage the

load lever.

CPU notches

Alignment Key

6

5. When you press down the load lever the PnP cap will automatically pop up from

the CPU socket. Do not discard the PnP cap. Always replace the PnP cap if the

CPU is removed from the socket.

6. Evenly spread a thin layer of thermal paste (or thermal tape) on the top of the

CPU. This will help in heat dissipation and prevent CPU overheating.

Thermal paste

English

7. Locate the CPU fan connector on the motherboard.

8. Place the heatsink on the motherboard with the fan’s cable facing towards the

fan connector and the fasteners matching the holes on the motherboard.

9. Push down the heatsink until the four fasteners get wedged into the holes on

the motherboard. Press the four fasteners down to fasten the heatsink. As each

fastener locks into position a click should be heard.

0. Inspect the motherboard to ensure that the fastener-ends have been properly

locked in place.

. Finally, attach the CPU fan cable to the CPU fan connector on the motherboard.

Important

Con󰘰rm that the CPU heatsink has formed a tight seal with the CPU before booting

your system.

Whenever the CPU is not installed, always protect the CPU socket pins by

covering the socket with the plastic cap.

If you purchased a separate CPU and heatsink/ cooler, Please refer to the

documentation in the heatsink/ cooler package for more details about installation.

7

Memory Installation

Video Demonstration

Watch the video to learn how to install memories at the address below.

http://youtu.be/76yLtJaKlCQ

English

2

3

Important

DDR3 memory modules are not interchangeable with DDR2, and the DDR3

standard is not backward compatible. Always install DDR3 memory modules in

DDR3 DIMM slots.

To ensure system stability, memory modules must be of the same type and density

in Dual-Channel mode.

8

Internal Connectors

JPWR~2: ATX Power Connectors

These connectors allow you to connect an ATX power supply. To connect the ATX

power supply, align the power supply cable with the connector and 󰘰rmly press the

cable into the connector. If done correctly, the clip on the power cable should be

hooked on the motherboard’s power connector.

Video Demonstration

English

Watch the video to learn how to install power supply connectors.

http://youtu.be/gkDYyR_83I4

9

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Important

Make sure that all the power cables are securely connected to a proper ATX power

supply to ensure stable operation of the motherboard.

JCOM2: Serial Port Connector

This connector is a 6550A high speed communication port that sends/receives 6

bytes FIFOs. You can attach a serial device.

1

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SATA~4: SATA Connectors

This connector is a high-speed SATA interface port. Each connector can connect to

one SATA device. SATA devices include disk drives (HDD), solid state drives (SSD),

and optical drives (CD/ DVD/ Blu-Ray).

Video Demonstration

English

Watch the video to learn how to Install SATA HDD.

http://youtu.be/RZsMpqxythc

Important

Many SATA devices also need a power cable from the power supply. Such devices

include disk drives (HDD), solid state drives (SSD), and optical drives (CD / DVD /

Blu-Ray). Please refer to the device’s manual for further information.

Many computer cases also require that large SATA devices, such as HDDs, SSDs,

and optical drives, be screwed down into the case. Refer to the manual that came

with your computer case or your SATA device for further installation instructions.

Please do not fold the SATA cable at a 90-degree angle. Data loss may result

during transmission otherwise.

SATA cables have identical plugs on either sides of the cable. However, it is

recommended that the 󰘱at connector be connected to the motherboard for space

saving purposes.

JCI: Chassis Intrusion Connector

This connector connects to the chassis intrusion switch cable. If the computer case

is opened, the chassis intrusion mechanism will be activated. The system will record

this intrusion and a warning message will 󰘱ash on screen. To clear the warning, you

must enter the BIOS utility and clear the record.

20

1

.

2

G

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CPUFAN,SYSFAN~2: Fan Power Connectors

The fan power connectors support system cooling fans with +2V. If the motherboard

has a System Hardware Monitor chipset on-board, you must use a specially designed

fan with a speed sensor to take advantage of the CPU fan control. Remember to

connect all system fans. Some system fans may not connect to the motherboard and

will instead connect to the power supply directly. A system fan can be plugged into

any available system fan connector.

English

2

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CPUFAN/ SYSFAN SYSFAN2

Important

Please refer to your processor’s o󰘲cial website or consult your vendor to 󰘰nd

recommended CPU heatsink.

These connectors support Smart Fan Control with liner mode. The Command

Center utility can be installed to automatically control the fan speeds according to

the CPU’s and system’s temperature.

If there are not enough ports on the motherboard to connect all system fans,

adapters are available to connect a fan directly to a power supply.

Before 󰘰rst boot up, ensure that there are no cables impeding any fan blades.

JAUD: Front Panel Audio Connector

This connector allows you to connect the front audio panel located on your computer

®

case. This connector is compliant with the Intel

Front Panel I/O Connectivity Design

Guide.

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JFP, JFP2: System Panel Connectors

These connectors connect to the front panel switches and LEDs. The JFP

®

connector is compliant with the Intel

Front Panel I/O Connectivity Design Guide.

When installing the front panel connectors, please use the optional M-Connector to

simplify installation. Plug all the wires from the computer case into the M-Connector

and then plug the M-Connector into the motherboard.

English

Video Demonstration

Watch the video to learn how to Install front panel connectors.

http://youtu.be/DPELIdVNZUI

22

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Important

On the connectors coming from the case, pins marked by small triangles are

positive wires. Please use the diagrams above and the writing on the optional M-

Connectors to determine correct connector orientation and placement.

The majority of the computer case’s front panel connectors will primarily be

plugged into JFP.

JUSB~2: USB 2.0 Expansion Connectors

This connector is designed for connecting high-speed USB peripherals such as USB

HDDs, digital cameras, MP3 players, printers, modems, and many others.

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Important

Note that the VCC and GND pins must be connected correctly to avoid possible

damage.

JUSB3: USB 3.0 Expansion Connector (optional)

The USB 3.0 port is backwards compatible with USB 2.0 devices. It supports data

transfer rates up to 5Gbits/s (SuperSpeed).

English

23

20.No

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18.USB3_RX_DN

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Important

Note that the VCC and GND pins must be connected correctly to avoid possible

damage.

To use a USB 3.0 device, you must connect the device to a USB 3.0 port through

an optional USB 3.0 compliant cable.

JTPM: TPM Module Connector

This connector connects to a TPM (Trusted Platform Module). Please refer to the

TPM security platform manual for more details and usages.

14.Ground

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JBAT: Clear CMOS Jumper

There is CMOS RAM onboard that is external powered from a battery located on the

motherboard to save system con󰘰guration data. With the CMOS RAM, the system

can automatically boot into the operating system (OS) every time it is turned on. If

you want to clear the system con󰘰guration, set the jumpers to clear the CMOS RAM.

English

Keep Data Clear Data

Important

You can clear the CMOS RAM by shorting this jumper while the system is o󰘯.

Afterwards, open the jumper . Do not clear the CMOS RAM while the system is on

because it will damage the motherboard.

JUSB_PW, JUSB_PW2: USB Power Jumper

These jumpers are used to assign which USB and PS/2 ports could support “Wake

Up Event Setup” 󰘰eld of BIOS.

JUSB_PW

(for back panel

USB ports &

PS/2 ports)

Support No Support (Default)

JUSB_PW2

(for onboard

USB connectors)

Support No Support (Default)

24

PCI_E~2: PCIe Expansion Slots

The PCIe slot supports the PCIe interface expansion card.

PCIe x6 Slot

English

PCIe x Slot

PCI~2: PCI Expansion Slots

The PCI slot supports the PCI interface expansion card..

PCI Slot

Important

When adding or removing expansion cards, always turn o󰘯 the power supply and

unplug the power supply power cable from the power outlet. Read the expansion

card’s documentation to check for any necessary additional hardware or software

changes.

25

BIOS Setup

The default settings o󰘯er the optimal performance for system stability in normal

conditions. You may need to run the Setup program when:

An error message appears on the screen during the system booting up, and

requests you to run SETUP.

English

You want to change the default settings for customized features.

Important

Please load the default settings to restore the optimal system performance and

stability if the system becomes unstable after changing BIOS settings. Select the

"Restore Defaults" and press <Enter> in BIOS to load the default settings.

If you are unfamiliar with the BIOS settings, we recommend that you keep the

default settings to avoid possible system damage or failure booting due to

inappropriate BIOS con󰘰guration.

Entering BIOS Setup

Power on the computer and the system will start the Power On Self Test (POST)

process. When the message below appears on the screen, please <DEL> key to

enter BIOS:

Press DEL key to enter Setup Menu, F to enter Boot Menu

If the message disappears before you respond and you still need to enter BIOS,

restart the system by turning the computer OFF then back ON or pressing the

RESET button. You may also restart the system by simultaneously pressing <Ctrl>,

<Alt>, and <Delete> keys.

MSI additionally provides two methods to enter the BIOS setup. You can click the

“GO2BIOS” tab on “MSI Fast Boot” utility screen or press the physical “GO2BIOS"

button (optional) on the motherboard to enable the system going to BIOS setup

directly at next boot.

Click "GO2BIOS" tab on "MSI Fast

Boot" utility screen.

Important

Please be sure to install the “MSI Fast Boot” utility before using it to enter the BIOS

setup.

26

Overview

After entering BIOS, the following screen is displayed.

Temperature monitor

Language

System

information

Model name

Virtual OC

Genie Button

Boot device

priority bar

English

BIOS menu

selection

BIOS menu

selection

Menu display

OC Menu

Important

Overclocking your PC manually is only recommended for advanced users.

Overclocking is not guaranteed, and if done improperly, can void your warranty or

severely damage your hardware.

If you are unfamiliar with overclocking, we advise you to use OC Genie for easy

overclocking.

27

Current CPU/ DRAM/ Ring Frequency

These items show the current frequencies of installed CPU, Memory and Ring.

Read-only.

CPU Ratio Mode [Auto]

Selects the CPU Ratio operating mode.

[Auto] This setting will be con󰘰gured automatically by BIOS.

English

[Fixed Mode] Fixes the CPU ratio.

[Dynamic Mode] CPU ratio will be changed dynamically according to the CPU

loading.

Adjust CPU Ratio [Auto]

Sets the CPU ratio that is used to determine CPU clock speed. This item can only be

changed if the processor supports this function.

Adjusted CPU Frequency

Shows the adjusted CPU frequency. Read-only.

EIST [Enabled]

®

Enables or disables the Enhanced Intel

SpeedStep Technology.

Intel Turbo Boost [Enabled]

®

Enables or disables the Intel

Turbo Boost. This item appears when the installed

CPU supports this function.

[Enabled] Enables this function to boost CPU performance automatically

above rated speci󰘰cations when system request the highest

performance state.

[Disabled] Disables this function.

Enhanced Turbo [Auto]

Enables or disables Enhanced Turbo function for all CPU cores to boost CPU

performance.

[Auto] This setting will be con󰘰gured automatically by BIOS.

[Enabled] All CPU cores would be increased to maximum turbo ratio.

[Disabled] Disables this function.

Adjust Ring Ratio [Auto]

Sets the ring ratio. The valid value range depends on the installed CPU.

Adjusted Ring Frequency

Shows the adjusted Ring frequency. Read-only.

Adjust GT Ratio [Auto]

Sets the integrated graphics ratio. The valid value range depends on the installed

CPU.

Adjusted GT Frequency

Shows the adjusted integrated graphics frequency. Read-only.

DRAM Frequency [Auto]

Sets the DRAM frequency. Please note the overclocking behavior is not guaranteed.

28

Adjusted DRAM Frequency

Shows the adjusted DRAM frequency. Read-only.

DRAM Timing Mode [Auto]

Selects the memory timing mode.

[Auto] DRAM timings will be determined based on SPD (Serial Presence

Detect) of installed memory modules.

[Link] Allows user to con󰘰gure the DRAM timing manually for all memory

channel.

[UnLink] Allows user to con󰘰gure the DRAM timing manually for respective

English

memory channel.

Advanced DRAM Con󰘰guration

Press <Enter> to enter the sub-menu. This sub-menu will be activated after setting

[Link] or [Unlink] in “DRAM Timing Mode”. User can set the memory timing for each

memory channel. The system may become unstable or unbootable after changing

memory timing. If it occurs, please clear the CMOS data and restore the default

settings. (Refer to the Clear CMOS jumper/ button section to clear the CMOS data,

and enter the BIOS to load the default settings.)

Memory Fast Boot [Auto]

Enables or disables the initiation and training for memory every booting.

[Auto] This setting will be con󰘰gured automatically by BIOS.

[Enabled] Memory will completely imitate the archive of 󰘰rst initiation and

󰘰rst training. After that, the memory will not be initialed and trained

when booting to accelerate the system booting time.

[Disabled] The memory will be initialed and trained every booting.

DRAM Voltage [Auto]

Sets the memory voltage. If set to "Auto", BIOS will set memory voltage

automatically or you can set it manually.

Spread Spectrum

This function reduces the EMI (Electromagnetic Interference) generated by

modulating clock generator pulses.

[Enabled] Enables the spread spectrum function to reduce the EMI

(Electromagnetic Interference) problem.

[Disabled] Enhances the overclocking ability of CPU Base clock.

Important

If you do not have any EMI problem, leave the setting at [Disabled] for optimal

system stability and performance. But if you are plagued by EMI, select the value

of Spread Spectrum for EMI reduction.

The greater the Spread Spectrum value is, the greater the EMI is reduced, and

the system will become less stable. For the most suitable Spread Spectrum value,

please consult your local EMI regulation.

Remember to disable Spread Spectrum if you are overclocking because even a

slight jitter can introduce a temporary boost in clock speed which may just cause

29

your overclocked processor to lock up.

CPU Features

Press <Enter> to enter the sub-menu.

Hyper-Threading Technology [Enabled]

The processor uses Hyper-Threading technology to increase transaction rates

English

and reduces end-user response times. Intel Hyper-Threading technology treats

the multi cores inside the processor as multi logical processors that can execute

instructions simultaneously. In this way, the system performance is highly

improved.

[Enable] Enables Intel Hyper-Threading technology.

[Disabled] Disables this item if the system does not support HT function.

Active Processor Cores [All]

This item allows you to select the number of active processor cores.

Limit CPUID Maximum [Disabled]

Enables or disables the extended CPUID value.

[Enabled] BIOS will limit the maximum CPUID input value to circumvent

boot problems with older operating system that do not support

the processor with extended CPUID value.

[Disabled] Use the actual maximum CPUID input value.

Execute Disable Bit [Enabled]

Intel’s Execute Disable Bit functionality can prevent certain classes of malicious

“bu󰘯er over󰘱ow” attacks where worms attempt to execute code to damage the

system. It is recommended that keeps this item enabled always.

[Enabled] Enables NO-Execution protection to prevent the malicious

attacks and worms.

[Disabled] Disables this function.

Intel Virtualization Tech [Enabled]

Enables or disables Intel Virtualization technology.

[Enabled] Enables Intel Virtualization technology and allows a platform

to run multiple operating systems in independent partitions.

The system can function as multiple systems virtually.

[Disabled] Disables this function.

Hardware Prefetcher [Enabled]

Enables or disables the hardware prefetcher (MLC Streamer prefetcher).

[Enabled] Allows the hardware prefetcher to automatically pre-fetch

data and instructions into L2 cache from memory for tuning

the CPU performance.

[Disabled] Disables the hardware prefetcher.

30

Adjacent Cache Line Prefetch [Enabled]

Enables or disables the CPU hardware prefetcher (MLC Spatial prefetcher).

[Enabled] Enables adjacent cache line prefetching for reducing the

cache latency time and tuning the performance to the speci󰘰c

application.

[Disabled] Enables the requested cache line only.

CPU AES Instructions [Enabled]

Enables or disables the CPU AES (Advanced Encryption Standard-New

Instructions) support. This item appears when a CPU supports this function.

English

[Enabled] Enables Intel AES support.

[Disabled] Disables Intel AES support.

Intel Adaptive Thermal Monitor [Enabled]

Enables or disables the Intel adaptive thermal monitor function to protect the

CPU from overheating.

[Enabled] Throttles down the CPU core clock speed when the CPU is

over the adaptive temperature.

[Disabled] Disables this function.

Intel C-State [Auto]

C-state is a processor power management technology de󰘰ned by ACPI.

[Auto] This setting will be con󰘰gured automatically by BIOS.

[Enabled] Detects the idle state of system and reduce CPU power

consumption accordingly.

[Disabled] Disable this function.

CE Support [Disabled]

Enables or disables the CE function for power-saving in halt state. This item

appears when "Intel C-State" is enabled.

[Enabled] Enables CE function to reduce the CPU frequency and

voltage for power-saving in halt state.

[Disabled] Disables this function.

Package C State limit [Auto]

This item allows you to select a CPU C-state mode for power-saving when

system is idle. This item appears when "Intel C-State" is enabled.

[Auto] This setting will be con󰘰gured automatically by BIOS.

[C0~C7s] The power-saving level from high to low is C7s, C7, C6, C3,

C2, then C0.

[No limit] No C-state limit for CPU.

LakeTiny Feature [Disabled]

Enables or disables Intel Lake Tiny feature with iRST for SSD. This item appears

when a installed CPU supports this function and "Intel C-State" is enabled.

[Enabled] Enhance the dynamic IO load adjusted performance for

accelerating the SSD speed.

[Disabled] Disables this feature.

3

Note: The following items will appear when "Intel Turbo Boost " is enabled.

Long Duration Power Limit (W) [Auto]

Sets the long duration TDP power limit for CPU in Turbo Boost mode.

Long Duration Maintained (s) [Auto]

Sets the maintaining time for "Long duration power Limit(W)".

English

Short Duration Power Limit (W) [Auto]

Sets the short duration TDP power limit for CPU in Turbo Boost mode.

CPU Current limit (A) [Auto]

Sets maximum current limit of CPU package in Turbo Boost mode. When the

current is over the speci󰘰ed limit value, the CPU will automatically reduce the

core frequency for reducing the current.

/2/3/4-Core Ratio Limit [Auto]

These items only appear when a CPU that support this function is installed.

These items allow you to set the CPU ratios for di󰘯erent number of active cores

in turbo boost mode. These items appear when the installed processor supports

this function.

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Аннотация для Материнской Платы MSI b85m-p32 в формате PDF