MSI b85m-p33: инструкция
Характеристики, спецификации
Инструкция к Материнской Плате MSI b85m-p33
Copyright Notice
The material in this document is the intellectual property of MICRO-STAR
INTERNATIONAL. We take every care in the preparation of this document, but no
guarantee is given as to the correctness of its contents. Our products are under
continual improvement and we reserve the right to make changes without notice.
Preface
Trademarks
All trademarks in this manual are properties of their respective owners.
®
■
MSI
is registered trademark of Micro-Star Int’l Co.,Ltd.
®
■
NVIDIA
is registered trademark of NVIDIA Corporation.
®
■
ATI
is registered trademark of AMD Corporation.
®
■
AMD
is registered trademarks of AMD Corporation.
®
■
Intel
is registered trademarks of Intel Corporation.
®
■
Windows
is registered trademarks of Microsoft Corporation.
®
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AMI
is registered trademark of American Megatrends Inc.
®
■
Award
is a registered trademark of Phoenix Technologies Ltd.
®
■
Sound Blaster
is registered trademark of Creative Technology Ltd.
®
■
Realtek
is registered trademark of Realtek Semiconductor Corporation.
®
■
JMicron
is registered trademark of JMicron Technology Corporation.
®
■
Netware
is registered trademark of Novell, Inc.
®
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Lucid
is trademark of LucidLogix Technologies, Ltd.
®
■
VIA
is registered trademark of VIA Technologies, Inc.
®
■
ASMedia
is registered trademark of ASMedia Technology Inc.
■
iPad, iPhone, and iPod are trademarks of Apple Inc.
■
Qualcomm Atheros and Killer are trademarks of Qualcomm Atheros Inc.
Revision History
Revision Revision History Date
V.0
First release 203/07
G52-787X
Safety Instructions
Preface
■
Always read the safety instructions carefully.
■
Keep this User’s Manual for future reference.
■
Keep this equipment away from humidity.
■
Lay this equipment on a reliable at surface before setting it up.
■
The openings on the enclosure are for air convection hence protects the
equipment from overheating. DO NOT COVER THE OPENINGS.
■
Make sure the voltage of the power source is at 0/220V before connecting the
equipment to the power inlet.
■
Place the power cord such a way that people can not step on it. Do not place
anything over the power cord.
■
Always Unplug the Power Cord before inserting any add-on card or module.
■
All cautions and warnings on the equipment should be noted.
■
Never pour any liquid into the opening that can cause damage or cause electrical
shock.
■
If any of the following situations arises, get the equipment checked by service
personnel:
◯
The power cord or plug is damaged.
◯
Liquid has penetrated into the equipment.
◯
The equipment has been exposed to moisture.
◯
The equipment does not work well or you can not get it work according to
User’s Manual.
◯
The equipment has been dropped and damaged.
◯
The equipment has obvious sign of breakage.
o
■
DO NOT LEAVE THIS EQUIPMENT IN AN ENVIRONMENT ABOVE 60
C
o
(40
F), IT MAY DAMAGE THE EQUIPMENT.
Battery Information
European Union:
Batteries, battery packs, and accumulators should not be disposed
of as unsorted household waste. Please use the public collection
system to return, recycle, or treat them in compliance with the local
regulations.
Taiwan:
For better environmental protection, waste batteries should be
collected separately for recycling or special disposal.
廢電池請回收
California, USA:
The button cell battery may contain perchlorate material and requires
special handling when recycled or disposed of in California.
For further information please visit:
http://www.dtsc.ca.gov/hazardouswaste/perchlorate/
CAUTION: There is a risk of explosion, if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by the manufacturer.
2
FCC-B Radio Frequency Interference Statement
This equipment has been tested and found to comply with the limits for a Class
B digital device, pursuant to Part 5 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency
Preface
energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause
harmful interference to radio or television reception, which can be determined
by turning the equipment o and on, the user is encouraged to try to correct the
interference by one or more of the measures listed below.
◯
Reorient or relocate the receiving antenna.
◯
Increase the separation between the equipment and receiver.
◯
Connect the equipment into an outlet on a circuit dierent from that to which
the receiver is connected.
◯
Consult the dealer or an experienced radio/television technician for help.
Notice
The changes or modications not expressly approved by the party responsible for
compliance could void the user’s authority to operate the equipment.
Notice 2
Shielded interface cables and A.C. power cord, if any, must be used in order to
comply with the emission limits.
VOIR LA NOTICE D’INSTALLATION AVANT DE RACCORDER AU RESEAU.
Micro-Star International
MS-787
This device complies with Part 5 of the FCC Rules. Operation is subject to the
following two conditions:
)
this device may not cause harmful interference, and
2)
this device must accept any interference received, including interference that
may cause undesired operation.
CE Conformity
Hereby, Micro-Star International CO., LTD declares that this device is
in compliance with the essential safety requirements and other relevant
provisions set out in the European Directive.
3
Radiation Exposure Statement
Preface
This equipment complies with FCC radiation exposure limits set forth for an
uncontrolled environment. This equipment and its antenna should be installed and
operated with minimum distance 20 cm between the radiator and your body. This
equipment and its antenna must not be co-located or operating in conjunction with
any other antenna or transmitter.
European Community Compliance Statement
The equipment complies with the RF Exposure Requirement 999/59/EC, Council
Recommendation of 2 July 999 on the limitation of exposure of the general public
to electromagnetic elds (0–300GHz). This wireless device complies with the R&TTE
Directive.
Taiwan Wireless Statements
無線設備警告聲明
經型式認證合格之低功率射頻電機,非經許可,公司、商號或使用者均不得擅自變更
頻率、加大功率或變更原設計之特性及功能。
低功率射頻電機之使用不得影響飛航安全及干擾合法通信;經發現有干擾現象時,應
立即停用,並改善至無干擾時方得繼續使用。前項合法通信,指依電信法規定作業之
無線電通信。低功率射頻電機須忍受合法通信或工業、科學及醫療用電波輻射性電機
設備之干擾。
警告使用者:這是甲類資訊產品,在居住的環境中使用時,可能會造成無線電干擾,在
這種情況下,使用者會被要求採取某些適當的對策。
Japan VCCI Class B Statement
クラス B 情報技術装置
この装置は、情報技術装置等電波障害自主規制協議会(VCCI)の基準に基づくクラ
スB情報技術装置です。この装置が家庭内でラジオやテレビジョン受信機に近接して
使われると、受信障害を引き起こすことがあります。取扱説明書にしたがって正し
い取り扱いをしてください。
Korea Warning Statements
당해 무선설비는 운용중 전파혼신 가능성이 있음
Chemical Substances Information
In compliance with chemical substances regulations, such as the EU REACH
Regulation (Regulation EC No. 907/2006 of the European Parliament and the
Council), MSI provides the information of chemical substances in products at:
http://www.msi.com/html/popup/csr/evmtprtt_pcm.html
4
产品中有毒有害物质或元素名称及含量
根据中国<电子信息产品污染控制管理办法>
有毒有害物质或元素
部件名称
铅
汞
镉
六价铬
多溴联苯
多溴二苯醚
(Pb)
(Hg)
(Cd)
(Cr6+)
(PBB)
(PBDE)
Preface
电池 (Battery) ☓ 〇 〇 〇 〇 〇
电缆/ 连接器
☓ 〇 〇 〇 〇 〇
(Cable/ Connector)
机箱/ 其他 (Chassis/ Other) ☓ 〇 〇 〇 〇 〇
光盘驱动器 (如CD, DVD等)
☓ 〇 〇 〇 〇 〇
(Optical Disk Driver)
硬盘驱动器
☓ 〇 〇 〇 〇 〇
(Hard Disk Driver)
印刷电路部件 (PCAs)* ☓ 〇 〇 〇 〇 〇
输出输入设备 (I/O Device)
☓ 〇 〇 〇 〇 〇
(如Mouse, Keyboard等)
液晶显示屏 (LCD Panel) ☓ ☓ 〇 〇 〇 〇
内存条 (Memory) ☓ 〇 〇 〇 〇 〇
处理器和散热器
☓ 〇 〇 〇 〇 〇
(Processor and Heatsink)
軟件 (如CD、DVD等) 〇 〇 〇 〇 〇 〇
电源 (Power Supply) ☓ 〇 ☓ 〇 〇 〇
遥控器 (Remote Control) ☓ 〇 〇 〇 〇 〇
扬声器 (Speakers) ☓ 〇 〇 〇 〇 〇
电视接收器 (TV Tunner) ☓ 〇 〇 〇 〇 〇
网络摄像头 (Web Camera) ☓ 〇 〇 〇 〇 〇
无线网卡 (Wireless Cards) ☓ 〇 〇 〇 〇 〇
■
*印刷电话部件包括所有印刷电路板(PCB)及其离散组件、IC。
■
上述有毒有害物质或元素清单会依产品出货现况之部件差异而有所增减。
■
〇:表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T363-
2006标准规定的限量要求下。
■
☓:表示该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T363-
2006标准规定的限量要求,但符合EU RoHS要求。
■
本产品在中国销售之电子讯息产品都必须遵守中国<电子讯息产品污染控制要求
>标准贴上环保使用期限EPUP (Environmental Protection Use Period)标签。
■
本产品使用之环保使用期限EPUP卷标符合中国-电子信息产品环保期限使用通
则(SJ/Z 388-2009)标示之要求(请参考下图EPUP卷标图标实例,标示内部之
编号适用于各指定产品。)
5
WEEE Statement
Preface
WEEE (Waste Electrical and Electronic Equipment)
ENGLISH
To protect the global environment and as an environmentalist, MSI must
remind you that...
Under the European Union (“EU”) Directive on Waste Electrical and
Electronic Equipment, Directive 2002/96/EC, which takes eect on August 3, 2005,
products of “electrical and electronic equipment” cannot be discarded as municipal
wastes anymore, and manufacturers of covered electronic equipment will be
obligated to take back such products at the end of their useful life. MSI will comply
with the product take back requirements at the end of life of MSI-branded products
that are sold into the EU. You can return these products to local collection points.
DEUTSCH
Hinweis von MSI zur Erhaltung und Schutz unserer Umwelt
Gemäß der Richtlinie 2002/96/EG über Elektro- und Elektronik-Altgeräte dürfen
Elektro- und Elektronik-Altgeräte nicht mehr als kommunale Abfälle entsorgt werden.
MSI hat europaweit verschiedene Sammel- und Recyclingunternehmen beauftragt,
die in die Europäische Union in Verkehr gebrachten Produkte, am Ende seines
Lebenszyklus zurückzunehmen. Bitte entsorgen Sie dieses Produkt zum gegebenen
Zeitpunkt ausschliesslich an einer lokalen Altgerätesammelstelle in Ihrer Nähe.
FRANÇAIS
En tant qu’écologiste et an de protéger l’environnement, MSI tient à rappeler ceci...
Au sujet de la directive européenne (EU) relative aux déchets des équipement
électriques et électroniques, directive 2002/96/EC, prenant eet le 3 août 2005,
que les produits électriques et électroniques ne peuvent être déposés dans les
décharges ou tout simplement mis à la poubelle. Les fabricants de ces équipements
seront obligés de récupérer certains produits en n de vie. MSI prendra en compte
cette exigence relative au retour des produits en n de vie au sein de la communauté
européenne. Par conséquent vous pouvez retourner localement ces matériels dans
les points de collecte.
РУССКИЙ
Компания MSI предпринимает активные действия по защите окружающей
среды, поэтому напоминаем вам, что....
В соответствии с директивой Европейского Союза (ЕС) по предотвращению
загрязнения окружающей среды использованным электрическим и электронным
оборудованием (директива WEEE 2002/96/EC), вступающей в силу 3
августа 2005 года, изделия, относящиеся к электрическому и электронному
оборудованию, не могут рассматриваться как бытовой мусор, поэтому
производители вышеперечисленного электронного оборудования обязаны
принимать его для переработки по окончании срока службы. MSI обязуется
соблюдать требования по приему продукции, проданной под маркой MSI на
территории EC, в переработку по окончании срока службы. Вы можете вернуть
эти изделия в специализированные пункты приема.
6
ESPAÑOL
MSI como empresa comprometida con la protección del medio ambiente,
recomienda:
Bajo la directiva 2002/96/EC de la Unión Europea en materia de desechos y/o
equipos electrónicos, con fecha de rigor desde el 3 de agosto de 2005, los
Preface
productos clasicados como “eléctricos y equipos electrónicos” no pueden ser
depositados en los contenedores habituales de su municipio, los fabricantes de
equipos electrónicos, están obligados a hacerse cargo de dichos productos al
termino de su período de vida. MSI estará comprometido con los términos de
recogida de sus productos vendidos en la Unión Europea al nal de su periodo de
vida. Usted debe depositar estos productos en el punto limpio establecido por el
ayuntamiento de su localidad o entregar a una empresa autorizada para la recogida
de estos residuos.
NEDERLANDS
Om het milieu te beschermen, wil MSI u eraan herinneren dat….
De richtlijn van de Europese Unie (EU) met betrekking tot Vervuiling van Electrische
en Electronische producten (2002/96/EC), die op 3 Augustus 2005 in zal gaan
kunnen niet meer beschouwd worden als vervuiling. Fabrikanten van dit soort
producten worden verplicht om producten retour te nemen aan het eind van hun
levenscyclus. MSI zal overeenkomstig de richtlijn handelen voor de producten
die de merknaam MSI dragen en verkocht zijn in de EU. Deze goederen kunnen
geretourneerd worden op lokale inzamelingspunten.
SRPSKI
Da bi zaštitili prirodnu sredinu, i kao preduzeće koje vodi računa o okolini i prirodnoj
sredini, MSI mora da vas podesti da…
Po Direktivi Evropske unije (“EU”) o odbačenoj ekektronskoj i električnoj opremi,
Direktiva 2002/96/EC, koja stupa na snagu od 3. Avgusta 2005, proizvodi koji
spadaju pod “elektronsku i električnu opremu” ne mogu više biti odbačeni kao običan
otpad i proizvođači ove opreme biće prinuđeni da uzmu natrag ove proizvode na
kraju njihovog uobičajenog veka trajanja. MSI će poštovati zahtev o preuzimanju
ovakvih proizvoda kojima je istekao vek trajanja, koji imaju MSI oznaku i koji su
prodati u EU. Ove proizvode možete vratiti na lokalnim mestima za prikupljanje.
POLSKI
Aby chronić nasze środowisko naturalne oraz jako rma dbająca o ekologię, MSI
przypomina, że...
Zgodnie z Dyrektywą Unii Europejskiej (“UE”) dotyczącą odpadów produktów
elektrycznych i elektronicznych (Dyrektywa 2002/96/EC), która wchodzi w życie 3
sierpnia 2005, tzw. “produkty oraz wyposażenie elektryczne i elektroniczne “ nie
mogą być traktowane jako śmieci komunalne, tak więc producenci tych produktów
będą zobowiązani do odbierania ich w momencie gdy produkt jest wycofywany z
użycia. MSI wypełni wymagania UE, przyjmując produkty (sprzedawane na terenie
Unii Europejskiej) wycofywane z użycia. Produkty MSI będzie można zwracać w
wyznaczonych punktach zbiorczych.
7
TÜRKÇE
Preface
Çevreci özelliğiyle bilinen MSI dünyada çevreyi korumak için hatırlatır:
Avrupa Birliği (AB) Kararnamesi Elektrik ve Elektronik Malzeme Atığı, 2002/96/EC
Kararnamesi altında 3 Ağustos 2005 tarihinden itibaren geçerli olmak üzere,
elektrikli ve elektronik malzemeler diğer atıklar gibi çöpe atılamayacak ve bu
elektonik cihazların üreticileri, cihazların kullanım süreleri bittikten sonra ürünleri geri
toplamakla yükümlü olacaktır. Avrupa Birliği’ne satılan MSI markalı ürünlerin kullanım
süreleri bittiğinde MSI ürünlerin geri alınması isteği ile işbirliği içerisinde olacaktır.
Ürünlerinizi yerel toplama noktalarına bırakabilirsiniz.
ČESKY
Záleží nám na ochraně životního prostředí - společnost MSI upozorňuje...
Podle směrnice Evropské unie (“EU”) o likvidaci elektrických a elektronických
výrobků 2002/96/EC platné od 3. srpna 2005 je zakázáno likvidovat “elektrické
a elektronické výrobky” v běžném komunálním odpadu a výrobci elektronických
výrobků, na které se tato směrnice vztahuje, budou povinni odebírat takové výrobky
zpět po skončení jejich životnosti. Společnost MSI splní požadavky na odebírání
výrobků značky MSI, prodávaných v zemích EU, po skončení jejich životnosti. Tyto
výrobky můžete odevzdat v místních sběrnách.
MAGYAR
Annak érdekében, hogy környezetünket megvédjük, illetve környezetvédőként
fellépve az MSI emlékezteti Önt, hogy ...
Az Európai Unió („EU”) 2005. augusztus 3-án hatályba lépő, az elektromos
és elektronikus berendezések hulladékairól szóló 2002/96/EK irányelve szerint
az elektromos és elektronikus berendezések többé nem kezelhetőek lakossági
hulladékként, és az ilyen elektronikus berendezések gyártói kötelessé válnak az
ilyen termékek visszavételére azok hasznos élettartama végén. Az MSI betartja
a termékvisszavétellel kapcsolatos követelményeket az MSI márkanév alatt az
EU-n belül értékesített termékek esetében, azok élettartamának végén. Az ilyen
termékeket a legközelebbi gyűjtőhelyre viheti.
ITALIANO
Per proteggere l’ambiente, MSI, da sempre amica della natura, ti ricorda che….
In base alla Direttiva dell’Unione Europea (EU) sullo Smaltimento dei Materiali
Elettrici ed Elettronici, Direttiva 2002/96/EC in vigore dal 3 Agosto 2005, prodotti
appartenenti alla categoria dei Materiali Elettrici ed Elettronici non possono più
essere eliminati come riuti municipali: i produttori di detti materiali saranno obbligati
a ritirare ogni prodotto alla ne del suo ciclo di vita. MSI si adeguerà a tale Direttiva
ritirando tutti i prodotti marchiati MSI che sono stati venduti all’interno dell’Unione
Europea alla ne del loro ciclo di vita. È possibile portare i prodotti nel più vicino
punto di raccolta
8
Contents
English ......................................................................................
Motherboard Specications ....................................................................................2
Optional Specications ...........................................................................................4
Preface
Back Panel ..............................................................................................................5
CPU & Heatsink Installation ....................................................................................6
Memory Installation .................................................................................................8
Internal Connectors.................................................................................................9
BIOS Setup .............................................................................................................26
한국어 .......................................................................................33
메인보드 사양 .........................................................................................................34
옵션 사양 .................................................................................................................36
후면 패널 .................................................................................................................37
CPU 및 히트싱크 설치 ............................................................................................38
메모리 .....................................................................................................................40
내장 커넥터 .............................................................................................................4
BIOS 설정 ...............................................................................................................48
Français ....................................................................................55
Spécications ..........................................................................................................56
Spécications en option ..........................................................................................58
Panneau Arrière ......................................................................................................59
Installation du CPU et son ventilateur .....................................................................60
Installation de mémoire ...........................................................................................62
Connecteurs d’alimentation ....................................................................................63
Conguration BIOS .................................................................................................70
Deutsch ....................................................................................77
Spezikationen........................................................................................................78
Optionale Spezikationen .......................................................................................80
Rücktafel-Übersicht.................................................................................................8
CPU & Kühlkörper Einbau ......................................................................................82
Speicher ..................................................................................................................84
Interne Anschlüsse .................................................................................................85
BIOS Setup .............................................................................................................92
9
Русский ....................................................................................99
Preface
Характеристики системной платы .....................................................................00
Дополнительные Характеристики ......................................................................02
Задняя панель .....................................................................................................03
Установка ЦП и радиатора .................................................................................04
Установка Памяти ...............................................................................................06
Внутренние разъемы ..........................................................................................07
Настройка BIOS ...................................................................................................4
简体中文 .................................................................................2
主板规格 ................................................................................................................22
选配规格 ................................................................................................................24
后置面板 ................................................................................................................25
CPU & 风扇安装 ....................................................................................................26
内存安装 ................................................................................................................28
内部接口 ................................................................................................................29
BIOS Setup(BIOS 设置) ...................................................................................36
繁體中文 .................................................................................43
規格 .......................................................................................................................44
各型號搭載規格對應表 ..........................................................................................46
背板快速指南 ........................................................................................................47
安裝 CPU 與散熱風扇 ...........................................................................................48
安裝記憶體 ............................................................................................................50
內建接頭 ................................................................................................................5
BIOS 設定 .............................................................................................................58
日本語 .....................................................................................65
マザーボードの仕様 ..............................................................................................66
オプションの仕様 .................................................................................................68
I/Oパネル ..............................................................................................................69
CPUおよびヒートシンクの装着 ...........................................................................70
メモリの装着 ........................................................................................................72
内部コネクター .....................................................................................................73
BIOSの設定 ...........................................................................................................80
0
English
CPUFAN
Top : mouse
Bottom: keyboard
USB2.0 ports
JPWR2
USB3.0 ports
DVI-D port
(for H81M-P33/
H87M-P33/ B85M-P33)
2
AN
HDMI port
(for H81M-E33/
H87M-E33/ B85M-E33)
SYSF
VGA port
JPWR1
JUSB_PW1
Top: LAN jack
DIMM1
DIMM2
Bottom: USB ports
SYSFAN1
T:Line-In
M:Line- Out
B:MIC-Int
PCI _E1
JBAT1
PCI _E2
JCI1
SATA2
JTPM1
JFP2
JUSB_PW2
JAUD1
SATA4 SATA3 SATA1
JCOM1
JFP1
JUSB2 JUSB1
English
Thank you for choosing the H8M-P33/ H8M-E33/ H87M-P33/ H87M-E33/ B85M-
P33/ B85M-E33 Series (MS-787 v.X) Micro-ATX motherboard. The H8M-P33/
H8M-E33/ H87M-P33/ H87M-E33/ B85M-P33/ B85M-E33 Series motherboards
are based on Intel H8/ H87/ B85 chipset for optimal system eciency. Designed to
t the advanced Intel LGA50 processor, the H8M-P33/ H8M-E33/ H87M-P33/
H87M-E33/ B85M-P33/ B85M-E33 Series motherboards deliver a high performance
and professional desktop platform solution.
Layout
Motherboard Specications
®
CPU
■
4th Generation Intel
Core™ i7 / Core™ i5 / Core™ i3 /
Support
®
®
Pentium
/ Celeron
processors for LGA 50 socket
®
Chipset Intel
H8/ H87/ B85 Express Chipset■
English
Memory
■
2x DDR3 memory slots supporting up to 6GB
Support
■
Supports DDR3 600/ 333/ 066 MHz
■
Dual channel memory architecture
■
Supports non-ECC, un-buered memory
Expansion
■
x PCIe x6 slot (optional)
Slots
■
x PCIe 2.0 x slot
Onboard
■
x HDMI port (optional), supporting a maximum resolution of
Graphics
2560x600@60Hz, 24bpp/ 920x080@60Hz, 36bpp
■
x DVI-D port (optional), supporting a maximum resolution of
920x200 @ 60Hz, 24bpp
■
x VGA port, supporting a maximum resolution of 920x200
@ 60Hz, 24bpp
Storage Intel H8/ H87/ B85 Express Chipset
■
-
4x SATA ports (optional)
-
Supports RAID 0, RAID, RAID 5 and RAID 0 (optional)
-
Supports Intel Smart Response Technology (optional)*
-
Supports Intel Rapid Start Technology (optional)*
-
Supports Intel Smart Connect Technology (optional)*
* Supports Intel Core processors on Windows 7 and Windows 8
USB Intel H8/ H87/ B85 Express Chipset
■
-
2x USB 3.0 ports on the back panel
-
8x USB 2.0 ports (4 ports on the back panel, 4 ports avail-
able through the internal USB connectors*)
®
Audio Realtek
ALC887 Codec■
®
LAN Realtek
RTL8G Gigabit LAN controller■
Back Panel
■
x PS/2 keyboard port
Connectors
■
x PS/2 mouse port
■
4x USB 2.0 ports
■
2x USB 3.0 ports
■
x HDMI port (optional)
■
x DVI-D port (optional)
■
x VGA port
■
x LAN (RJ45) port
■
3x audio jacks
2
Internal
■
x 24-pin ATX main power connector
Connectors
■
x 4-pin ATX 2V power connector
■
4x SATA connectors
■
2x USB 2.0 connectors (supports additional 4 USB 2.0 ports)
■
x 4-pin CPU fan connector
■
x 4-pin system fan connector
■
x 3-pin system fan connector
■
x Front panel audio connector
■
2x System panel connectors
English
■
x Chassis Intrusion connector
■
x Clear CMOS jumper
■
2x USB power jumpers
BIOS
■
UEFI AMI BIOS
Features
■
ACPI 5.0, PnP .0a, SM BIOS 2.7, DMI 2.0
■
Multi-language
Form Factor Micro-ATX Form Factor
■
■
8.9 in. x 6.8 in. (22.6 cm x 7.3 cm)
For the latest information about CPU, please visit
http://www.msi.com/service/cpu-support/
For more information on compatible components, please
visit http://www.msi.com/service/test-report/
3
Optional Specications
Name
H8M-P33 H8M-E33 H87M-P33
Specication
English
PCIe x6 slot Gen2 Gen2 Gen3
DVI-D/ HDMI DVI-D HDMI DVI-D
SATA, SATA2 SATA 6Gb/s SATA 6Gb/s SATA 6Gb/s
SATA3, SATA4 SATA 3Gb/s SATA 3Gb/s SATA 6Gb/s
BIOS ROM 64Mb 64Mb 28Mb
RAID Not supported Not supported Supported
Small Business
Not supported Not supported Supported
Advantage
Intel Rapid Start Not supported Not supported Supported
Intel Smart Response Not supported Not supported Supported
Intel Smart Connect Supported Supported Supported
Name
H87M-E33 B85M-P33 B85M-E33
Specication
PCIe x6 slot Gen3 Gen3 Gen3
DVI-D/ HDMI HDMI DVI-D HDMI
SATA, SATA2 SATA 6Gb/s SATA 6Gb/s SATA 6Gb/s
SATA3, SATA4 SATA 6Gb/s SATA 3Gb/s SATA 3Gb/s
BIOS ROM 28Mb 28Mb 28Mb
RAID Supported Not supported Not supported
Small Business
Supported Supported Supported
Advantage
Intel Rapid Start Supported Supported Supported
Intel Smart Response Supported Not supported Not supported
Intel Smart Connect Supported Supported Supported
4
Back Panel
H8M-E33/ H87M-E33/ B85M-E33
LAN
PS/2 Mouse
Line-In
USB 2.0
VGA
Line-Out
HDMI
English
Mic
PS/2 Keyboard
USB 3.0
USB 2.0
H8M-P33/ H87M-P33/ B85M-P33
LAN
PS/2 Mouse
Line-In
USB 2.0
VGA
DVI-D
Line-Out
Mic
PS/2 Keyboard
USB 3.0
USB 2.0
LAN LED Indicator
LINK/ACT
SPEED
LED
LED
LED LED Status Description
O No link
Link/ Activity LED
Yellow Linked
Blinking Data activity
O 0 Mbps connection
Speed LED
Green 00 Mbps connection
Orange Gbps connection
5
CPU & Heatsink Installation
When installing a CPU, always remember to install a CPU heatsink. A CPU heatsink
is necessary to prevent overheating and maintain system stability. Follow the steps
below to ensure correct CPU and heatsink installation. Wrong installation can
damage both the CPU and the motherboard.
English
Video Demonstration
Watch the video to learn how to install CPU & heatsink. at the
address below.
http://youtu.be/bf5La099urI
. Push the load lever down to unclip it and lift to the fully open position.
2. The load plate will automatically lift up as the load lever is pushed to the fully
open position.
Important
Do not touch the socket contacts or the bottom of the CPU.
3. Align the notches with the socket alignment keys. Lower the CPU straight down,
without tilting or sliding the CPU in the socket. Inspect the CPU to check if it is
properly seated in the socket.
4. Close and slide the load plate under the retention knob. Close and engage the
load lever.
CPU notches
Alignment Key
6
5. When you press down the load lever the PnP cap will automatically pop up from
the CPU socket. Do not discard the PnP cap. Always replace the PnP cap if the
CPU is removed from the socket.
6. Evenly spread a thin layer of thermal paste (or thermal tape) on the top of the
CPU. This will help in heat dissipation and prevent CPU overheating.
Thermal paste
English
7. Locate the CPU fan connector on the motherboard.
8. Place the heatsink on the motherboard with the fan’s cable facing towards the
fan connector and the fasteners matching the holes on the motherboard.
9. Push down the heatsink until the four fasteners get wedged into the holes on
the motherboard. Press the four fasteners down to fasten the heatsink. As each
fastener locks into position a click should be heard.
0. Inspect the motherboard to ensure that the fastener-ends have been properly
locked in place.
. Finally, attach the CPU fan cable to the CPU fan connector on the motherboard.
Important
•
Conrm that the CPU heatsink has formed a tight seal with the CPU before booting
your system.
•
Whenever the CPU is not installed, always protect the CPU socket pins by
covering the socket with the plastic cap.
•
If you purchased a separate CPU and heatsink/ cooler, Please refer to the
documentation in the heatsink/ cooler package for more details about installation.
7
Memory Installation
Video Demonstration
Watch the video to learn how to install memories at the address below.
http://youtu.be/76yLtJaKlCQ
English
2
3
Important
•
DDR3 memory modules are not interchangeable with DDR2, and the DDR3
standard is not backward compatible. Always install DDR3 memory modules in
DDR3 DIMM slots.
•
To ensure system stability, memory modules must be of the same type and density
in Dual-Channel mode.
8
Internal Connectors
JPWR~2: ATX Power Connectors
These connectors allow you to connect an ATX power supply. To connect the ATX
power supply, align the power supply cable with the connector and rmly press the
cable into the connector. If done correctly, the clip on the power cable should be
hooked on the motherboard’s power connector.
Video Demonstration
English
Watch the video to learn how to install power supply connectors.
http://youtu.be/gkDYyR_83I4
9
12.+3.3
11
10.+12V
.+12V
9.5VSB
8.PW
V
7
6.+5
.Ground
5
R O
4.+5
.Ground
V
K
3
2.+3.3
.Ground
V
1.+3.3
24.Ground
V
23.+5
V
22.+5
21.+5
20.Res
V
19.Ground
V
18.Ground
V
17.Ground
16.PS-ON
15.Ground
14.-12V
13.+3.3
#
V
JPWR
1
.Ground
2
.Ground
3.+12V
4.+12V
JPWR2
Important
Make sure that all the power cables are securely connected to a proper ATX power
supply to ensure stable operation of the motherboard.
JCOM: Serial Port Connector
This connector is a 6550A high speed communication port that sends/receives 6
bytes FIFOs. You can attach a serial device.
1
0
8
.
.
N
6
C
o
.
D
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D
SATA~4: SATA Connectors
This connector is a high-speed SATA interface port. Each connector can connect to
one SATA device. SATA devices include disk drives (HDD), solid state drives (SSD),
and optical drives (CD/ DVD/ Blu-Ray).
Video Demonstration
English
Watch the video to learn how to Install SATA HDD.
http://youtu.be/RZsMpqxythc
Important
Many SATA devices also need a power cable from the power supply. Such devices
include disk drives (HDD), solid state drives (SSD), and optical drives (CD / DVD /
Blu-Ray). Please refer to the device’s manual for further information.
Many computer cases also require that large SATA devices, such as HDDs, SSDs,
and optical drives, be screwed down into the case. Refer to the manual that came
with your computer case or your SATA device for further installation instructions.
Please do not fold the SATA cable at a 90-degree angle. Data loss may result
during transmission otherwise.
SATA cables have identical plugs on either sides of the cable. However, it is
recommended that the at connector be connected to the motherboard for space
saving purposes.
JCI: Chassis Intrusion Connector
This connector connects to the chassis intrusion switch cable. If the computer case
is opened, the chassis intrusion mechanism will be activated. The system will record
this intrusion and a warning message will ash on screen. To clear the warning, you
must enter the BIOS utility and clear the record.
20
1
.
2
G
.
C
r
o
I
u
N
n
T
d
R
U
•
•
•
•
CPUFAN,SYSFAN~2: Fan Power Connectors
The fan power connectors support system cooling fans with +2V. If the motherboard
has a System Hardware Monitor chipset on-board, you must use a specially designed
fan with a speed sensor to take advantage of the CPU fan control. Remember to
connect all system fans. Some system fans may not connect to the motherboard and
will instead connect to the power supply directly. A system fan can be plugged into
any available system fan connector.
English
2
1
2.+12V
.Ground
3.Sens
4.Speed
e
C
ontro
l
1
2.+12V
.Ground
3.No
Us
e
CPUFAN/ SYSFAN SYSFAN2
Important
•
Please refer to your processor’s ocial website or consult your vendor to nd
recommended CPU heatsink.
•
These connectors support Smart Fan Control with liner mode. The Command
Center utility can be installed to automatically control the fan speeds according to
the CPU’s and system’s temperature.
•
If there are not enough ports on the motherboard to connect all system fans,
adapters are available to connect a fan directly to a power supply.
•
Before rst boot up, ensure that there are no cables impeding any fan blades.
JFP, JFP2: System Panel Connectors
These connectors connect to the front panel switches and LEDs. The JFP
®
connector is compliant with the Intel
Front Panel I/O Connectivity Design Guide.
When installing the front panel connectors, please use the optional M-Connector to
simplify installation. Plug all the wires from the computer case into the M-Connector
and then plug the M-Connector into the motherboard.
English
Video Demonstration
Watch the video to learn how to Install front panel connectors.
http://youtu.be/DPELIdVNZUI
22
4.VCC5
3.Speaker
2.VCC5
1.Speaker
P
ower
P
Switc h
10.No
ower
LE
Pi
D
8.
n
6.
-
4.
+
2.
-
+
9.Res erve
7.
5.-
+
3.
1.
-
+
Reset
d
HDD
S
witch
LE
D
JFP
JFP2
Important
On the connectors coming from the case, pins marked by small triangles are
positive wires. Please use the diagrams above and the writing on the optional M-
Connectors to determine correct connector orientation and placement.
The majority of the computer case’s front panel connectors will primarily be
plugged into JFP.
JUSB~2: USB 2.0 Expansion Connectors
This connector is designed for connecting high-speed USB peripherals such as USB
HDDs, digital cameras, MP3 players, printers, modems, and many others.
1
0
8
.
.
NC
6
G
.
r
4
U
o
.
S
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S
B
n
.
V
d
B
0
C
C
0
+
-
•
•
Important
Note that the VCC and GND pins must be connected correctly to avoid possible
damage.
JAUD: Front Panel Audio Connector
This connector allows you to connect the front audio panel located on your computer
®
case. This connector is compliant with the Intel
Front Panel I/O Connectivity Design
Guide.
English
23
10.Head
8.No
6.MI
4.NC
Pi
P
2
C D
n
hone
.Ground
etection
Detection
9.Head
7.SENSE_SEN
5.Head
3.MIC R
P
1.MI
hone
P
C L
hone
L
D
R
JTPM: TPM Module Connector
This connector connects to a TPM (Trusted Platform Module). Please refer to the
TPM security platform manual for more details and usages.
14.Ground
12.Ground
10.No
8.5V
6.Serial
Pi
4.3.3V
P
n
ower
2.3V
P
IR
Standby
ower
Q
p
ower
13.LP
11
9.LP
.LPC
C
7.LP
Fram
5.LP
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3.LP
C a
ddres
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data
loc
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pin2
in3
p
p
in1
in0
JBAT: Clear CMOS Jumper
There is CMOS RAM onboard that is external powered from a battery located on the
motherboard to save system conguration data. With the CMOS RAM, the system
can automatically boot into the operating system (OS) every time it is turned on. If
you want to clear the system conguration, set the jumpers to clear the CMOS RAM.
English
Keep Data Clear Data
Important
You can clear the CMOS RAM by shorting this jumper while the system is o.
Afterwards, open the jumper . Do not clear the CMOS RAM while the system is on
because it will damage the motherboard.
JUSB_PW, JUSB_PW2: USB Power Jumper
These jumpers are used to assign which USB and PS/2 ports could support “Wake
Up Event Setup” eld of BIOS.
JUSB_PW
(for back panel
USB ports &
PS/2 ports)
Support
No Support (Default)
JUSB_PW2
(for onboard
USB connectors)
Support
No Support (Default)
24
PCI_E~2: PCIe Expansion Slots
The PCIe slot supports the PCIe interface expansion card.
PCIe 3.0 x6 Slot
English
PCIe 2.0 x Slot
Important
When adding or removing expansion cards, always turn o the power supply and
unplug the power supply power cable from the power outlet. Read the expansion
card’s documentation to check for any necessary additional hardware or software
changes.
25
BIOS Setup
The default settings oer the optimal performance for system stability in normal
conditions. You may need to run the Setup program when:
■
An error message appears on the screen during the system booting up, and
requests you to run SETUP.
English
■
You want to change the default settings for customized features.
Important
•
Please load the default settings to restore the optimal system performance and
stability if the system becomes unstable after changing BIOS settings. Select the
"Restore Defaults" and press <Enter> in BIOS to load the default settings.
•
If you are unfamiliar with the BIOS settings, we recommend that you keep the
default settings to avoid possible system damage or failure booting due to
inappropriate BIOS conguration.
Entering BIOS Setup
Power on the computer and the system will start the Power On Self Test (POST)
process. When the message below appears on the screen, please <DEL> key to
enter BIOS:
Press DEL key to enter Setup Menu, F to enter Boot Menu
If the message disappears before you respond and you still need to enter BIOS,
restart the system by turning the computer OFF then back ON or pressing the
RESET button. You may also restart the system by simultaneously pressing <Ctrl>,
<Alt>, and <Delete> keys.
MSI additionally provides two methods to enter the BIOS setup. You can click the
“GO2BIOS” tab on “MSI Fast Boot” utility screen or press the physical “GO2BIOS"
button (optional) on the motherboard to enable the system going to BIOS setup
directly at next boot.
Click "GO2BIOS" tab on "MSI Fast
Boot" utility screen.
Important
Please be sure to install the “MSI Fast Boot” utility before using it to enter the BIOS
setup.
26
Overview
After entering BIOS, the following screen is displayed.
Temperature monitor
Language
System
information
Model name
Virtual OC
Genie Button
Boot device
priority bar
English
BIOS menu
selection
BIOS menu
selection
Menu display
OC Menu
Important
•
Overclocking your PC manually is only recommended for advanced users.
•
Overclocking is not guaranteed, and if done improperly, can void your warranty or
severely damage your hardware.
•
If you are unfamiliar with overclocking, we advise you to use OC Genie for easy
overclocking.
27
▶
Current CPU/ DRAM/ Ring Frequency
These items show the current frequencies of installed CPU, Memory and Ring.
Read-only.
▶
CPU Ratio Mode [Auto]
Selects the CPU Ratio operating mode.
[Auto] This setting will be congured automatically by BIOS.
English
[Fixed Mode] Fixes the CPU ratio.
[Dynamic Mode] CPU ratio will be changed dynamically according to the CPU
loading.
▶
Adjust CPU Ratio [Auto]
Sets the CPU ratio that is used to determine CPU clock speed. This item can only be
changed if the processor supports this function.
▶
Adjusted CPU Frequency
Shows the adjusted CPU frequency. Read-only.
▶
EIST [Enabled]
®
Enables or disables the Enhanced Intel
SpeedStep Technology.
▶
Intel Turbo Boost [Enabled]
®
Enables or disables the Intel
Turbo Boost. This item appears when the installed
CPU supports this function.
[Enabled] Enables this function to boost CPU performance automatically
above rated specications when system request the highest
performance state.
[Disabled] Disables this function.
▶
Enhanced Turbo [Auto]
Enables or disables Enhanced Turbo function for all CPU cores to boost CPU
performance.
[Auto] This setting will be congured automatically by BIOS.
[Enabled] All CPU cores would be increased to maximum turbo ratio.
[Disabled] Disables this function.
▶
Adjust Ring Ratio [Auto]
Sets the ring ratio. The valid value range depends on the installed CPU.
▶
Adjusted Ring Frequency
Shows the adjusted Ring frequency. Read-only.
▶
Adjust GT Ratio [Auto]
Sets the integrated graphics ratio. The valid value range depends on the installed
CPU.
▶
Adjusted GT Frequency
Shows the adjusted integrated graphics frequency. Read-only.
▶
DRAM Frequency [Auto]
Sets the DRAM frequency. Please note the overclocking behavior is not guaranteed.
28
▶
Adjusted DRAM Frequency
Shows the adjusted DRAM frequency. Read-only.
▶
DRAM Timing Mode [Auto]
Selects the memory timing mode.
[Auto] DRAM timings will be determined based on SPD (Serial Presence
Detect) of installed memory modules.
[Link] Allows user to congure the DRAM timing manually for all memory
channel.
[UnLink] Allows user to congure the DRAM timing manually for respective
English
memory channel.
▶
Advanced DRAM Conguration
Press <Enter> to enter the sub-menu. This sub-menu will be activated after setting
[Link] or [Unlink] in “DRAM Timing Mode”. User can set the memory timing for each
memory channel. The system may become unstable or unbootable after changing
memory timing. If it occurs, please clear the CMOS data and restore the default
settings. (Refer to the Clear CMOS jumper/ button section to clear the CMOS data,
and enter the BIOS to load the default settings.)
▶
Memory Fast Boot [Auto]
Enables or disables the initiation and training for memory every booting.
[Auto] This setting will be congured automatically by BIOS.
[Enabled] Memory will completely imitate the archive of rst initiation and
rst training. After that, the memory will not be initialed and trained
when booting to accelerate the system booting time.
[Disabled] The memory will be initialed and trained every booting.
▶
DRAM Voltage [Auto]
Sets the memory voltage. If set to "Auto", BIOS will set memory voltage
automatically or you can set it manually.
▶
Spread Spectrum
This function reduces the EMI (Electromagnetic Interference) generated by
modulating clock generator pulses.
[Enabled] Enables the spread spectrum function to reduce the EMI
(Electromagnetic Interference) problem.
[Disabled] Enhances the overclocking ability of CPU Base clock.
Important
•
If you do not have any EMI problem, leave the setting at [Disabled] for optimal
system stability and performance. But if you are plagued by EMI, select the value
of Spread Spectrum for EMI reduction.
•
The greater the Spread Spectrum value is, the greater the EMI is reduced, and
the system will become less stable. For the most suitable Spread Spectrum value,
please consult your local EMI regulation.
•
Remember to disable Spread Spectrum if you are overclocking because even a
slight jitter can introduce a temporary boost in clock speed which may just cause
29
your overclocked processor to lock up.
▶
CPU Features
Press <Enter> to enter the sub-menu.
▶
Hyper-Threading Technology [Enabled]
The processor uses Hyper-Threading technology to increase transaction rates
English
and reduces end-user response times. Intel Hyper-Threading technology treats
the multi cores inside the processor as multi logical processors that can execute
instructions simultaneously. In this way, the system performance is highly
improved.
[Enable] Enables Intel Hyper-Threading technology.
[Disabled] Disables this item if the system does not support HT function.
▶
Active Processor Cores [All]
This item allows you to select the number of active processor cores.
▶
Limit CPUID Maximum [Disabled]
Enables or disables the extended CPUID value.
[Enabled] BIOS will limit the maximum CPUID input value to circumvent
boot problems with older operating system that do not support
the processor with extended CPUID value.
[Disabled] Use the actual maximum CPUID input value.
▶
Execute Disable Bit [Enabled]
Intel’s Execute Disable Bit functionality can prevent certain classes of malicious
“buer overow” attacks where worms attempt to execute code to damage the
system. It is recommended that keeps this item enabled always.
[Enabled] Enables NO-Execution protection to prevent the malicious
attacks and worms.
[Disabled] Disables this function.
▶
Intel Virtualization Tech [Enabled]
Enables or disables Intel Virtualization technology.
[Enabled] Enables Intel Virtualization technology and allows a platform
to run multiple operating systems in independent partitions.
The system can function as multiple systems virtually.
[Disabled] Disables this function.
▶
Hardware Prefetcher [Enabled]
Enables or disables the hardware prefetcher (MLC Streamer prefetcher).
[Enabled] Allows the hardware prefetcher to automatically pre-fetch
data and instructions into L2 cache from memory for tuning
the CPU performance.
[Disabled] Disables the hardware prefetcher.
30
▶
Adjacent Cache Line Prefetch [Enabled]
Enables or disables the CPU hardware prefetcher (MLC Spatial prefetcher).
[Enabled] Enables adjacent cache line prefetching for reducing the
cache latency time and tuning the performance to the specic
application.
[Disabled] Enables the requested cache line only.
▶
CPU AES Instructions [Enabled]
Enables or disables the CPU AES (Advanced Encryption Standard-New
Instructions) support. This item appears when a CPU supports this function.
English
[Enabled] Enables Intel AES support.
[Disabled] Disables Intel AES support.
▶
Intel Adaptive Thermal Monitor [Enabled]
Enables or disables the Intel adaptive thermal monitor function to protect the
CPU from overheating.
[Enabled] Throttles down the CPU core clock speed when the CPU is
over the adaptive temperature.
[Disabled] Disables this function.
▶
Intel C-State [Auto]
C-state is a processor power management technology dened by ACPI.
[Auto] This setting will be congured automatically by BIOS.
[Enabled] Detects the idle state of system and reduce CPU power
consumption accordingly.
[Disabled] Disable this function.
▶
CE Support [Disabled]
Enables or disables the CE function for power-saving in halt state. This item
appears when "Intel C-State" is enabled.
[Enabled] Enables CE function to reduce the CPU frequency and
voltage for power-saving in halt state.
[Disabled] Disables this function.
▶
Package C State limit [Auto]
This item allows you to select a CPU C-state mode for power-saving when
system is idle. This item appears when "Intel C-State" is enabled.
[Auto] This setting will be congured automatically by BIOS.
[C0~C7s] The power-saving level from high to low is C7s, C7, C6, C3,
C2, then C0.
[No limit] No C-state limit for CPU.
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LakeTiny Feature [Disabled]
Enables or disables Intel Lake Tiny feature with iRST for SSD. This item appears
when a installed CPU supports this function and "Intel C-State" is enabled.
[Enabled] Enhance the dynamic IO load adjusted performance for
accelerating the SSD speed.
[Disabled] Disables this feature.
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Note: The following items will appear when "Intel Turbo Boost " is enabled.
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Long Duration Power Limit (W) [Auto]
Sets the long duration TDP power limit for CPU in Turbo Boost mode.
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Long Duration Maintained (s) [Auto]
Sets the maintaining time for "Long duration power Limit(W)".
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Short Duration Power Limit (W) [Auto]
Sets the short duration TDP power limit for CPU in Turbo Boost mode.
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CPU Current limit (A) [Auto]
Sets maximum current limit of CPU package in Turbo Boost mode. When the
current is over the specied limit value, the CPU will automatically reduce the
core frequency for reducing the current.
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/2/3/4-Core Ratio Limit [Auto]
These items only appear when a CPU that support this function is installed.
These items allow you to set the CPU ratios for dierent number of active cores
in turbo boost mode. These items appear when the installed processor supports
this function.
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