MSI H81TI: instruction
Class: Computer equipment, hardware, accessories
Type: Motherboard
Manual for MSI H81TI

Copyright Notice
The material in this document is the intellectual property of MICRO-STAR
INTERNATIONAL. We take every care in the preparation of this document, but no
guarantee is given as to the correctness of its contents. Our products are under
continual improvement and we reserve the right to make changes without notice.
Preface
Trademarks
All trademarks in this manual are properties of their respective owners.
®
■
MSI
is registered trademark of Micro-Star Int’l Co.,Ltd.
®
■
NVIDIA
is registered trademark of NVIDIA Corporation.
®
■
ATI
is registered trademark of AMD Corporation.
®
■
AMD
is registered trademarks of AMD Corporation.
®
■
Intel
is registered trademarks of Intel Corporation.
®
■
Windows
is registered trademarks of Microsoft Corporation.
®
■
AMI
is registered trademark of American Megatrends Inc.
®
■
Award
is a registered trademark of Phoenix Technologies Ltd.
®
■
Sound Blaster
is registered trademark of Creative Technology Ltd.
®
■
Realtek
is registered trademark of Realtek Semiconductor Corporation.
®
■
JMicron
is registered trademark of JMicron Technology Corporation.
®
■
Netware
is registered trademark of Novell, Inc.
®
■
Lucid
is trademark of LucidLogix Technologies, Ltd.
®
■
VIA
is registered trademark of VIA Technologies, Inc.
®
■
ASMedia
is registered trademark of ASMedia Technology Inc.
■
iPad, iPhone, and iPod are trademarks of Apple Inc.
■
Qualcomm Atheros and Killer are trademarks of Qualcomm Atheros Inc.
Revision History
Revision Revision History Date
V2.0 First release 203/ 2
G52-7799X

Safety Instructions
Preface
■
Always read the safety instructions carefully.
■
Keep this User’s Manual for future reference.
■
Keep this equipment away from humidity.
■
Lay this equipment on a reliable at surface before setting it up.
■
The openings on the enclosure are for air convection hence protects the
equipment from overheating. DO NOT COVER THE OPENINGS.
■
Make sure the voltage of the power source is at 0/220V before connecting the
equipment to the power inlet.
■
Place the power cord such a way that people can not step on it. Do not place
anything over the power cord.
■
Always Unplug the Power Cord before inserting any add-on card or module.
■
All cautions and warnings on the equipment should be noted.
■
Never pour any liquid into the opening that can cause damage or cause electrical
shock.
■
If any of the following situations arises, get the equipment checked by service
personnel:
◯
The power cord or plug is damaged.
◯
Liquid has penetrated into the equipment.
◯
The equipment has been exposed to moisture.
◯
The equipment does not work well or you can not get it work according to
User’s Manual.
◯
The equipment has been dropped and damaged.
◯
The equipment has obvious sign of breakage.
o
■
DO NOT LEAVE THIS EQUIPMENT IN AN ENVIRONMENT ABOVE 60
C
o
(40
F), IT MAY DAMAGE THE EQUIPMENT.
Battery Information
European Union:
Batteries, battery packs, and accumulators should not be disposed
of as unsorted household waste. Please use the public collection
system to return, recycle, or treat them in compliance with the local
regulations.
Taiwan:
For better environmental protection, waste batteries should be
collected separately for recycling or special disposal.
廢電池請回收
California, USA:
The button cell battery may contain perchlorate material and requires
special handling when recycled or disposed of in California.
For further information please visit:
http://www.dtsc.ca.gov/hazardouswaste/perchlorate/
CAUTION: There is a risk of explosion, if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by the manufacturer.
2

FCC-B Radio Frequency Interference Statement
This equipment has been tested and found to comply with the limits for a Class
B digital device, pursuant to Part 5 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency
Preface
energy and, if not installed and used in accordance with the instructions, may cause
harmful interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause
harmful interference to radio or television reception, which can be determined
by turning the equipment o and on, the user is encouraged to try to correct the
interference by one or more of the measures listed below.
◯
Reorient or relocate the receiving antenna.
◯
Increase the separation between the equipment and receiver.
◯
Connect the equipment into an outlet on a circuit dierent from that to which
the receiver is connected.
◯
Consult the dealer or an experienced radio/television technician for help.
Notice
The changes or modications not expressly approved by the party responsible for
compliance could void the user’s authority to operate the equipment.
Notice 2
Shielded interface cables and A.C. power cord, if any, must be used in order to
comply with the emission limits.
VOIR LA NOTICE D’INSTALLATION AVANT DE RACCORDER AU RESEAU.
Micro-Star International
MS-7799
This device complies with Part 5 of the FCC Rules. Operation is subject to the
following two conditions:
)
this device may not cause harmful interference, and
2)
this device must accept any interference received, including interference that
may cause undesired operation.
CE Conformity
Hereby, Micro-Star International CO., LTD declares that this device is
in compliance with the essential safety requirements and other relevant
provisions set out in the European Directive.
3

Radiation Exposure Statement
Preface
This equipment complies with FCC radiation exposure limits set forth for an
uncontrolled environment. This equipment and its antenna should be installed and
operated with minimum distance 20 cm between the radiator and your body. This
equipment and its antenna must not be co-located or operating in conjunction with
any other antenna or transmitter.
European Community Compliance Statement
The equipment complies with the RF Exposure Requirement 999/59/EC, Council
Recommendation of 2 July 999 on the limitation of exposure of the general public
to electromagnetic elds (0–300GHz). This wireless device complies with the R&TTE
Directive.
Taiwan Wireless Statements
無線設備警告聲明
經型式認證合格之低功率射頻電機,非經許可,公司、商號或使用者均不得擅自變更
頻率、加大功率或變更原設計之特性及功能。
低功率射頻電機之使用不得影響飛航安全及干擾合法通信;經發現有干擾現象時,應
立即停用,並改善至無干擾時方得繼續使用。前項合法通信,指依電信法規定作業之
無線電通信。低功率射頻電機須忍受合法通信或工業、科學及醫療用電波輻射性電機
設備之干擾。
警告使用者:這是甲類資訊產品,在居住的環境中使用時,可能會造成無線電干擾,在
這種情況下,使用者會被要求採取某些適當的對策。
Japan VCCI Class B Statement
クラス B 情報技術装置
この装置は、情報技術装置等電波障害自主規制協議会(VCCI)の基準に基づくクラ
スB情報技術装置です。この装置が家庭内でラジオやテレビジョン受信機に近接して
使われると、受信障害を引き起こすことがあります。取扱説明書にしたがって正し
い取り扱いをしてください。
Korea Warning Statements
당해 무선설비는 운용중 전파혼신 가능성이 있음
Chemical Substances Information
In compliance with chemical substances regulations, such as the EU REACH
Regulation (Regulation EC No. 907/2006 of the European Parliament and the
Council), MSI provides the information of chemical substances in products at:
http://www.msi.com/html/popup/csr/evmtprtt_pcm.html
4

产品中有毒有害物质或元素名称及含量
根据中国<电子信息产品污染控制管理办法>
有毒有害物质或元素
Preface
部件名称
铅
汞
镉
六价铬
多溴联苯
多溴二苯醚
(Pb)
(Hg)
(Cd)
(Cr6+)
(PBB)
(PBDE)
印刷电路板组件* ☓ 〇 〇 〇 〇 〇
电池**
☓ 〇 〇 〇 〇 〇
外部信号连接头 ☓ 〇 〇 〇 〇 〇
线材 ☓ 〇 〇 〇 〇 〇
〇: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T363-2006标
准规定的限量要求下。
☓: 表示该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T363-
2006标准规定的限量要求,但所有部件都符合欧盟RoHS要求。
* 印刷电路板组件: 包括印刷电路板及其构成的零部件。
** 电池本体上如有环保使用期限标识,以本体标识为主。
■
上述有毒有害物质或元素清单会依型号之部件差异而有所增减。
■
產品部件本体上如有环保使用期限标识,以本体标识为主。
5

WEEE Statement
Preface
WEEE (Waste Electrical and Electronic Equipment)
ENGLISH
To protect the global environment and as an environmentalist, MSI must
remind you that...
Under the European Union (“EU”) Directive on Waste Electrical and
Electronic Equipment, Directive 2002/96/EC, which takes eect on August 3, 2005,
products of “electrical and electronic equipment” cannot be discarded as municipal
wastes anymore, and manufacturers of covered electronic equipment will be
obligated to take back such products at the end of their useful life. MSI will comply
with the product take back requirements at the end of life of MSI-branded products
that are sold into the EU. You can return these products to local collection points.
DEUTSCH
Hinweis von MSI zur Erhaltung und Schutz unserer Umwelt
Gemäß der Richtlinie 2002/96/EG über Elektro- und Elektronik-Altgeräte dürfen
Elektro- und Elektronik-Altgeräte nicht mehr als kommunale Abfälle entsorgt werden.
MSI hat europaweit verschiedene Sammel- und Recyclingunternehmen beauftragt,
die in die Europäische Union in Verkehr gebrachten Produkte, am Ende seines
Lebenszyklus zurückzunehmen. Bitte entsorgen Sie dieses Produkt zum gegebenen
Zeitpunkt ausschliesslich an einer lokalen Altgerätesammelstelle in Ihrer Nähe.
FRANÇAIS
En tant qu’écologiste et an de protéger l’environnement, MSI tient à rappeler ceci...
Au sujet de la directive européenne (EU) relative aux déchets des équipement
électriques et électroniques, directive 2002/96/EC, prenant eet le 3 août 2005,
que les produits électriques et électroniques ne peuvent être déposés dans les
décharges ou tout simplement mis à la poubelle. Les fabricants de ces équipements
seront obligés de récupérer certains produits en n de vie. MSI prendra en compte
cette exigence relative au retour des produits en n de vie au sein de la communauté
européenne. Par conséquent vous pouvez retourner localement ces matériels dans
les points de collecte.
РУССКИЙ
Компания MSI предпринимает активные действия по защите окружающей
среды, поэтому напоминаем вам, что....
В соответствии с директивой Европейского Союза (ЕС) по предотвращению
загрязнения окружающей среды использованным электрическим и электронным
оборудованием (директива WEEE 2002/96/EC), вступающей в силу 3
августа 2005 года, изделия, относящиеся к электрическому и электронному
оборудованию, не могут рассматриваться как бытовой мусор, поэтому
производители вышеперечисленного электронного оборудования обязаны
принимать его для переработки по окончании срока службы. MSI обязуется
соблюдать требования по приему продукции, проданной под маркой MSI на
территории EC, в переработку по окончании срока службы. Вы можете вернуть
эти изделия в специализированные пункты приема.
6

ESPAÑOL
MSI como empresa comprometida con la protección del medio ambiente,
recomienda:
Bajo la directiva 2002/96/EC de la Unión Europea en materia de desechos y/o
equipos electrónicos, con fecha de rigor desde el 3 de agosto de 2005, los
Preface
productos clasicados como “eléctricos y equipos electrónicos” no pueden ser
depositados en los contenedores habituales de su municipio, los fabricantes de
equipos electrónicos, están obligados a hacerse cargo de dichos productos al
termino de su período de vida. MSI estará comprometido con los términos de
recogida de sus productos vendidos en la Unión Europea al nal de su periodo de
vida. Usted debe depositar estos productos en el punto limpio establecido por el
ayuntamiento de su localidad o entregar a una empresa autorizada para la recogida
de estos residuos.
NEDERLANDS
Om het milieu te beschermen, wil MSI u eraan herinneren dat….
De richtlijn van de Europese Unie (EU) met betrekking tot Vervuiling van Electrische
en Electronische producten (2002/96/EC), die op 3 Augustus 2005 in zal gaan
kunnen niet meer beschouwd worden als vervuiling. Fabrikanten van dit soort
producten worden verplicht om producten retour te nemen aan het eind van hun
levenscyclus. MSI zal overeenkomstig de richtlijn handelen voor de producten
die de merknaam MSI dragen en verkocht zijn in de EU. Deze goederen kunnen
geretourneerd worden op lokale inzamelingspunten.
SRPSKI
Da bi zaštitili prirodnu sredinu, i kao preduzeće koje vodi računa o okolini i prirodnoj
sredini, MSI mora da vas podesti da…
Po Direktivi Evropske unije (“EU”) o odbačenoj ekektronskoj i električnoj opremi,
Direktiva 2002/96/EC, koja stupa na snagu od 3. Avgusta 2005, proizvodi koji
spadaju pod “elektronsku i električnu opremu” ne mogu više biti odbačeni kao običan
otpad i proizvođači ove opreme biće prinuđeni da uzmu natrag ove proizvode na
kraju njihovog uobičajenog veka trajanja. MSI će poštovati zahtev o preuzimanju
ovakvih proizvoda kojima je istekao vek trajanja, koji imaju MSI oznaku i koji su
prodati u EU. Ove proizvode možete vratiti na lokalnim mestima za prikupljanje.
POLSKI
Aby chronić nasze środowisko naturalne oraz jako rma dbająca o ekologię, MSI
przypomina, że...
Zgodnie z Dyrektywą Unii Europejskiej (“UE”) dotyczącą odpadów produktów
elektrycznych i elektronicznych (Dyrektywa 2002/96/EC), która wchodzi w życie 3
sierpnia 2005, tzw. “produkty oraz wyposażenie elektryczne i elektroniczne “ nie
mogą być traktowane jako śmieci komunalne, tak więc producenci tych produktów
będą zobowiązani do odbierania ich w momencie gdy produkt jest wycofywany z
użycia. MSI wypełni wymagania UE, przyjmując produkty (sprzedawane na terenie
Unii Europejskiej) wycofywane z użycia. Produkty MSI będzie można zwracać w
wyznaczonych punktach zbiorczych.
7

TÜRKÇE
Preface
Çevreci özelliğiyle bilinen MSI dünyada çevreyi korumak için hatırlatır:
Avrupa Birliği (AB) Kararnamesi Elektrik ve Elektronik Malzeme Atığı, 2002/96/EC
Kararnamesi altında 3 Ağustos 2005 tarihinden itibaren geçerli olmak üzere,
elektrikli ve elektronik malzemeler diğer atıklar gibi çöpe atılamayacak ve bu
elektonik cihazların üreticileri, cihazların kullanım süreleri bittikten sonra ürünleri geri
toplamakla yükümlü olacaktır. Avrupa Birliği’ne satılan MSI markalı ürünlerin kullanım
süreleri bittiğinde MSI ürünlerin geri alınması isteği ile işbirliği içerisinde olacaktır.
Ürünlerinizi yerel toplama noktalarına bırakabilirsiniz.
ČESKY
Záleží nám na ochraně životního prostředí - společnost MSI upozorňuje...
Podle směrnice Evropské unie (“EU”) o likvidaci elektrických a elektronických
výrobků 2002/96/EC platné od 3. srpna 2005 je zakázáno likvidovat “elektrické
a elektronické výrobky” v běžném komunálním odpadu a výrobci elektronických
výrobků, na které se tato směrnice vztahuje, budou povinni odebírat takové výrobky
zpět po skončení jejich životnosti. Společnost MSI splní požadavky na odebírání
výrobků značky MSI, prodávaných v zemích EU, po skončení jejich životnosti. Tyto
výrobky můžete odevzdat v místních sběrnách.
MAGYAR
Annak érdekében, hogy környezetünket megvédjük, illetve környezetvédőként
fellépve az MSI emlékezteti Önt, hogy ...
Az Európai Unió („EU”) 2005. augusztus 3-án hatályba lépő, az elektromos
és elektronikus berendezések hulladékairól szóló 2002/96/EK irányelve szerint
az elektromos és elektronikus berendezések többé nem kezelhetőek lakossági
hulladékként, és az ilyen elektronikus berendezések gyártói kötelessé válnak az
ilyen termékek visszavételére azok hasznos élettartama végén. Az MSI betartja
a termékvisszavétellel kapcsolatos követelményeket az MSI márkanév alatt az
EU-n belül értékesített termékek esetében, azok élettartamának végén. Az ilyen
termékeket a legközelebbi gyűjtőhelyre viheti.
ITALIANO
Per proteggere l’ambiente, MSI, da sempre amica della natura, ti ricorda che….
In base alla Direttiva dell’Unione Europea (EU) sullo Smaltimento dei Materiali
Elettrici ed Elettronici, Direttiva 2002/96/EC in vigore dal 3 Agosto 2005, prodotti
appartenenti alla categoria dei Materiali Elettrici ed Elettronici non possono più
essere eliminati come riuti municipali: i produttori di detti materiali saranno obbligati
a ritirare ogni prodotto alla ne del suo ciclo di vita. MSI si adeguerà a tale Direttiva
ritirando tutti i prodotti marchiati MSI che sono stati venduti all’interno dell’Unione
Europea alla ne del loro ciclo di vita. È possibile portare i prodotti nel più vicino
punto di raccolta

Contents
English ......................................................................................
Motherboard Specications ....................................................................................2
Back Panel ..............................................................................................................4
Preface
CPU & Heatsink Installation ....................................................................................5
Memory Installation .................................................................................................7
Internal Connectors.................................................................................................
BIOS Setup .............................................................................................................26
한국어 .......................................................................................33
메인보드 사양 .........................................................................................................34
후면 패널 .................................................................................................................36
CPU 및 히트싱크 설치 ............................................................................................37
메모리 설치 .............................................................................................................39
내장 커넥터 .............................................................................................................40
BIOS 설정 ...............................................................................................................4
Français ....................................................................................55
Spécications ..........................................................................................................56
Panneau Arrière ......................................................................................................5
Installation du CPU et son ventilateur .....................................................................59
Installation de mémoire ...........................................................................................6
Connecteurs internes ..............................................................................................62
Conguration BIOS .................................................................................................70
Deutsch ....................................................................................77
Spezikationen........................................................................................................7
Rücktafel-Übersicht.................................................................................................0
CPU & Kühlkörper Einbau ......................................................................................
Speicher ..................................................................................................................3
Interne Anschlüsse .................................................................................................4
BIOS Setup .............................................................................................................92
Русский ....................................................................................99
Характеристики материнской платы..................................................................00
Задняя панель .....................................................................................................02
Установка ЦП и радиатора .................................................................................03
Установка памяти ................................................................................................05
Внутренние разъемы ..........................................................................................06
Настройка BIOS ..................................................................................................4
9

简体中文 .................................................................................2
Preface
主板规格 ................................................................................................................22
后置面板指南 ........................................................................................................24
CPU & 风扇安装 ....................................................................................................25
内存安装 ................................................................................................................27
内部接口 ................................................................................................................2
BIOS Setup ...........................................................................................................36
繁體中文 .................................................................................43
主機板規格 ............................................................................................................44
背板 .......................................................................................................................46
安裝 CPU 與散熱風扇 ...........................................................................................47
安裝記憶體 ............................................................................................................49
內建接頭 ................................................................................................................50
BIOS 設定 .............................................................................................................5
日本語 .....................................................................................65
マザーボードの仕様 ..............................................................................................66
I/Oパネル ..............................................................................................................6
CPUおよびヒートシンクの装着 ...........................................................................69
メモリの装着 ........................................................................................................7
内部コネクター .....................................................................................................72
BIOSの設定 ...........................................................................................................0
0

English
Thank you for choosing the HTI Series (MS-7799 v2.X) Thin Mini-ITX
motherboard. The HTI Series motherboards are based on Intel H chipset for
optimal system eciency. Designed to t the advanced Intel LGA50 processor,
the HTI Series motherboards deliver a high performance and professional desktop
platform solution.
Layout
English
SATA_POWER1
JCIR1
JFP1
SYSFAN1
SATA1
JFPD1
DC in connector
SATA2
CPUFAN
JMONITOR_SWITCH1
JLVDS_BK1
E-SATA
port
DIMM2
VDS1
JL
HDMI
port
MINI_PCIE1
DIMM1
LVDS_POWER1
USB 2.0
ports
JUSB1
USB 3.0
ports
JBAT1
JCI1
LAN port
Line-out
port
Mic-in
JUSB2
port
MINI_PCIE2
JAUD1
JAMP1
JTPM1
JDMIC1

Motherboard Specications
®
CPU
■
4th Generation Intel
Core™ i7 / Core™ i5 / Core™ i3 /
Support
®
®
Pentium
/ Celeron
processors for LGA 50 socket
®
Chipset Intel
H Express Chipset■
English
Memory
■
2x DDR3 SO-DIMM memory slots supporting up to 6GB
Support
■
Supports DDR3 600/ 333/ 066 MHz
■
Dual channel memory architecture
Expansion
■
x Mini-PCIe x slot (MINI_PCIE2)*
Slots
* For half size
Onboard
■
x HDMI port, supporting a maximum resolution of
Graphics
4096x260@24Hz
Storage Intel H Express Chipset
■
-
2x SATA 6Gb/s ports
-
x mSATA 3Gb/s port (MINI_PCIE)*
* Also could support mini-PCIe interface card.
USB 3.0 Intel H Express Chipset
■
-
2x USB 3.0 ports on the back panel
USB 2.0 Intel H Express Chipset
■
-
6x USB 2.0 ports (2 ports on the back panel, 4 ports
available through the internal USB 2.0 connectors)
®
Audio Realtek
ALC7 Codec■
®
LAN Realtek
RTLG Gigabit LAN controller■
Back Panel
■
x DC power-in connector
Connectors
■
x eSATA port
■
x HDMI port
■
2x USB 2.0 ports
■
2x USB 3.0 ports
■
x LAN (RJ45) port
■
2x audio jacks (Mic-In, Line-out)
2

Internal
■
x SATA power connector
Connectors
■
2x SATA 6Gb/s connectors
■
2x USB 2.0 connectors (supports additional 4 USB 2.0 ports)
■
x 4-pin CPU fan connector
■
x 4-pin System fan connector
■
x Front panel audio connector
■
x TPM connector
■
x System panel connector
■
x Chassis intrusion connector
English
■
x Clear CMOS jumper
■
x Flat panel display connector
■
x Flat panel display switch connector
■
x LVDS connector
■
x LVDS power connector
■
x LVDS backlight power connector
■
x Digital microphone connector
■
x Audio amplier connector
■
x Consumer infrared receiver connector
BIOS
■
UEFI AMI BIOS
Features
■
ACPI 5.0, PnP .0a, SM BIOS 2.7, DMI 2.0
■
Multi-language
Form Factor Thin mini-ITX Form Factor
■
■
6.7 in. x 6.7 in. (7.0 cm x 7.0 cm)
For the latest information about CPU, please visit
http://www.msi.com/service/cpu-support/
For more information on compatible components, please
visit http://www.msi.com/service/test-report/
3

Back Panel
USB 2.0
LAN
DC Power-in
English
eSATA
USB 3.0
Line-out Mic-inHDMI
DC Power-in
This connector allows you to connect the DC power.
LAN LED Indicator
LINK/ACT
SPEED
LED
LED
LED LED Status Description
O No link
Link/ Activity LED
Yellow Linked
Blinking Data activity
O 0 Mbps connection
Speed LED
Green 00 Mbps connection
Orange Gbps connection
Line-out (Green)
Line-out, the default front speaker out jack, is a connector for headphone or
speakers.
Mic-in (Pink)
Mic-in, the default microphone-in jack, is a connector for microphone.
4
®

CPU & Heatsink Installation
When installing a CPU, always remember to install a CPU heatsink. A CPU heatsink
is necessary to prevent overheating and maintain system stability. Follow the steps
below to ensure correct CPU and heatsink installation. Wrong installation can
damage both the CPU and the motherboard.
Video Demonstration
Watch the video to learn how to install CPU & heatsink.
English
http://youtu.be/bf5La099urI
. Push the load lever down to unclip it and lift to the fully open position.
2. The load plate will automatically lift up as the load lever is pushed to the fully
open position.
Important
Do not touch the socket contacts or the bottom of the CPU.
3. Align the notches with the socket alignment keys. Lower the CPU straight down,
without tilting or sliding the CPU in the socket. Inspect the CPU to check if it is
properly seated in the socket.
4. Close and slide the load plate under the retention knob. Close and engage the
load lever.
CPU notches
Alignment Key
5

5. When you press down the load lever the PnP cap will automatically pop up from
the CPU socket. Do not discard the PnP cap. Always replace the PnP cap if the
CPU is removed from the socket.
6. Evenly spread a thin layer of thermal paste (or thermal tape) on the top of the
CPU. This will help in heat dissipation and prevent CPU overheating.
English
Thermal paste
7. Locate the CPU fan connector on the motherboard.
. Place the heatsink on the motherboard with the fan’s cable facing towards the
fan connector and the fasteners matching the holes on the motherboard.
9. Push down the heatsink until the four fasteners get wedged into the holes on
the motherboard. Press the four fasteners down to fasten the heatsink. As each
fastener locks into position a click should be heard.
0. Inspect the motherboard to ensure that the fastener-ends have been properly
locked in place.
. Finally, attach the CPU fan cable to the CPU fan connector on the motherboard.
Important
•
Conrm that the CPU heatsink has formed a tight seal with the CPU before booting
your system.
•
Whenever the CPU is not installed, always protect the CPU socket pins by
covering the socket with the plastic cap.
•
If you purchased a separate CPU and heatsink/ cooler, Please refer to the
documentation in the heatsink/ cooler package for more details about installation.
6

Memory Installation
The SO-DIMM slot is intended for memory modules.
.
Locate the SO-DIMM slot. Align the notch on the DIMM with the key on the slot
and insert the DIMM into the slot.
2.
Push the DIMM gently downwards until the slot levers click and lock the DIMM
in place.
English
2
Important
•
You can barely see the golden nger if the DIMM is properly inserted in the DIMM
slot.
•
To uninstall the DIMM, ip the slot levers outwards and the DIMM will be released
instantly.
7

Internal Connectors
SATA_POWER: SATA Power Connector
This connector is used to provide power to SATA device. Please use a SATA power
cable connect onboard SATA power connector with SATA device’s power connector.
English
SATA~2: SATA Connectors
This connector is a high-speed SATA interface port. Each connector can connect to
one SATA device. SATA devices include disk drives (HDD), solid state drives (SSD),
and optical drives (CD/ DVD/ Blu-Ray).
Video Demonstration
Watch the video to learn how to Install SATA HDD.
http://youtu.be/RZsMpqxythc
SATA
SATA2
Important
•
Many SATA devices also need a power cable from the power supply. Such devices
include disk drives (HDD), solid state drives (SSD), and optical drives (CD / DVD /
Blu-Ray). Please refer to the device’s manual for further information.
•
Many computer cases also require that large SATA devices, such as HDDs, SSDs,
and optical drives, be screwed down into the case. Refer to the manual that came
with your computer case or your SATA device for further installation instructions.
•
Please do not fold the SATA cable at a 90-degree angle. Data loss may result
during transmission otherwise.
•
SATA cables have identical plugs on either sides of the cable. However, it is
recommended that the at connector be connected to the motherboard for space
saving purposes.

JCI: Chassis Intrusion Connector
This connector connects to the chassis intrusion switch cable. If the computer case
is opened, the chassis intrusion mechanism will be activated. The system will record
this intrusion and a warning message will ash on screen. To clear the warning, you
must enter the BIOS utility and clear the record.
English
9
1
.
2
G
.
C
r
o
I
u
N
n
T
d
R
U
CPUFAN,SYSFAN: Fan Power Connectors
The fan power connectors support system cooling fans with +2V. If the motherboard
has a System Hardware Monitor chipset on-board, you must use a specially designed
fan with a speed sensor to take advantage of the CPU fan control. Remember to
connect all system fans. Some system fans may not connect to the motherboard and
will instead connect to the power supply directly. A system fan can be plugged into
any available system fan connector.
1.Ground
2.+12V
3.Sens
4.Speed
e
C
ontro
l
CPUFAN SYSFAN
1.Ground
2.Speed
3.Sens
4.NC
e
C
ontro
l
Important
•
Please refer to your processor’s ocial website or consult your vendor to nd
recommended CPU heatsink.
•
These connectors support Smart Fan Control with liner mode. The Command
Center utility can be installed to automatically control the fan speeds according to
the CPU’s and system’s temperature.
•
If there are not enough ports on the motherboard to connect all system fans,
adapters are available to connect a fan directly to a power supply.
•
Before rst boot up, ensure that there are no cables impeding any fan blades.

JAUD: Front Panel Audio Connector
This connector allows you to connect the front audio panel located on your computer
®
case. This connector is compliant with the Intel
Front Panel I/O Connectivity Design
Guide.
English
20
10.Head
8.No
6.MI
4.NC
Pi
P
2
C D
n
hone
.Ground
etection
Detection
9.Head
7.SENSE_SEN
5.Head
3.MI
P
1.MI
hone
C R
P
C L
hone
L
D
R
JAMP: Audio Amplier Connector
This connector is used to connect audio ampliers to enhance audio performance.
4
.Front_R-
3
.Front_R+
2
1
.Front_L+
.Front_L-
JTPM: TPM Module Connector
This connector connects to a TPM (Trusted Platform Module). Please refer to the
TPM security platform manual for more details and usages.
14.Ground
12.Ground
10.No
8.5V
6.Serial
Pi
4.3.3V
P
n
ower
2.3V
P
IR
Standby
ower
Q
p
ower
13.LP
11
9.LP
.LPC
C
7.LP
Fram
5.LP
C a
a
3.LP
C a
ddres
ddres
e
1.LP
C a
ddres
C
ddres
s &
C C
Rese
s &
s &
data
loc
data
t
s &
k
data
pin3
data
pin2
p
p
in1
in0

JUSB~2: USB 2.0 Expansion Connectors
This connector is designed for connecting high-speed USB peripherals such as USB
HDDs, digital cameras, MP3 players, printers, modems, and many others.
English
2
1
0
8
.
.
NC
6
G
.
r
4
U
o
.
S
u
2
U
S
B
n
.
V
1
d
C
B
+
1
C
-
9
.
7
N
.
G
o
5
3
.
U
r
P
o
i
.
S
u
n
1
U
S
B
n
.
V
d
B
0
C
C
0
+
-
Important
Note that the VCC and GND pins must be connected correctly to avoid possible
damage.
JFP: System Panel Connector
This connector connects to the front panel switches and LEDs. The JFP connector
®
is compliant with the Intel
Front Panel I/O Connectivity Design Guide. When
installing the front panel connector, please use the optional M-Connector to simplify
installation. Plug all the wires from the computer case into the M-Connector and then
plug the M-Connector into the motherboard.
Video Demonstration
Watch the video to learn how to Install front panel connector.
http://youtu.be/DPELIdVNZUI
P
owe r
P
S
owe r
wit ch
10. No
LE
Pi
D
8.
n
6.
-
4.-
+
2.
+
9.R eserv e
7.
5.
+
3.
-
1.
-
+
Res et
d
HDD
S
wit ch
LE
D
Important
On the connectors coming from the case, pins marked by small triangles are positive
wires. Please use the diagrams above and the writing on the optional M-Connectors
to determine correct connector orientation and placement.

JCIR: Consumer Infrared Receiver Connector
This connector is used to connect to a consumer infrared receiver. You must
congure the setting through the BIOS setup to use the infrared function.
English
22
8.CIR_input
6.VC
4.Learn_in+
2.LE
C
D
5.5V
3.
1.
NC
Standby
Ground
JDMIC: Digital Microphone Connector
This connector is used to connect to the digital microphone.
4.DMIC_CLOCK
3
.GN
2.DMIC_DA
1.+3.3
D
V
TA
.
JMONITOR_SWITCH: Flat Panel Display Switch Connector
This connector is used to connect an on/ o switch for at panel display.
2.GN
1.MON_S
D
W

JFPD: Flat Panel Display Connector
This connector provides a high-speed interface typically used with at panel displays.
English
23
8.Brightness_Down
7.Brightness_Up
6.BKL
5.BK
4.BKL
T_GND/
3.BK
LT
2.BKL
T_PW
_GND/
1.BKL
LT
T_PW
_PWR
Brightness_GN
R
T_EN
Brightness_GN
M
D
D
JLVDS: LVDS Connector
The LVDS (Low Voltage Dierential Signal) connector provides a digital interface
typically used with at panels. After connecting an LVDS interface at panel to the
LVDS connector, be sure to check the panel datasheet and set the LVDS power
connector to proper power voltage.
Pin Denition Pin Denition
. ODD_Lane3_P 2. NC
2. ODD_Lane3_N 22. EDID_3.3V
40
3. ODD_Lane2_P 23. LCD_GND
4. ODD_Lane2_N 24. LCD_GND
5. ODD_Lane_P 25. LCD_GND
6. ODD_Lane_N 26. ODD_CLK_P
7. ODD_Lane0_P 27. ODD_CLK_N
. ODD_Lane0_N 2. BLKT_GND
9. EVEN_Lane3_P 29. BLKT_GND
0. EVEN_Lane3_N 30. BLKT_GND
. EVEN_Lane2_P 3. EDID_CLK
2. EVEN_Lane2_N 32. BLKT_ENABLE
3. EVEN_Lane_P 33. BLKT_PWM_DIM
4. EVEN_Lane_N 34. EVEN_CLK_P
5. EVEN_Lane0_P 35. EVEN_CLK_N
6. EVEN_Lane0_N 36. BLKT_PWR
7. EDID_GND 37. BLKT_PWR
. LCD_VCC 3. BLKT_PWR
9. LCD_VCC 39. NC
20. LCD_VCC 40. EDID_DATA

JLVDS_POWER: LVDS Power Connector
Use this connector to specify the operation voltage of the LVDS interface at panel.
5
5
5
4
3
4
3
4
3
English
5V
3V
9V
(default)
JLVDS_BK: LVDS Backlight Power Connector
This connector is provided for LCD backlight options.
9V
2V
(default)
JBAT: Clear CMOS Jumper
There is CMOS RAM onboard that is external powered from a battery located on the
motherboard to save system conguration data. With the CMOS RAM, the system
can automatically boot into the operating system (OS) every time it is turned on. If
you want to clear the system conguration, set the jumpers to clear the CMOS RAM.
Keep Data Clear Data
Important
You can clear the CMOS RAM by shorting this jumper while the system is o.
Afterwards, open the jumper . Do not clear the CMOS RAM while the system is on
because it will damage the motherboard.
24

MINI_PCIE~2: Mini - PCIe Expansion Slots
The mini-PCIe slot supports the mini-PCIe interface expansion card.
MINI_PCIE supports full size
and also supports mSATA
function.
MINI_PCIE2 supports half size
English
Important
When adding or removing expansion cards, always turn o the power supply and
unplug the power supply power cable from the power outlet. Read the expansion
card’s documentation to check for any necessary additional hardware or software
changes.
25

BIOS Setup
The default settings oer the optimal performance for system stability in normal
conditions. You may need to run the Setup program when:
■
An error message appears on the screen during the system booting up, and
requests you to run SETUP.
English
■
You want to change the default settings for customized features.
Important
•
Please load the default settings to restore the optimal system performance and
stability if the system becomes unstable after changing BIOS settings. Select the
"Restore Defaults" and press <Enter> in BIOS to load the default settings.
•
If you are unfamiliar with the BIOS settings, we recommend that you keep the
default settings to avoid possible system damage or failure booting due to
inappropriate BIOS conguration.
Entering BIOS Setup
Power on the computer and the system will start the Power On Self Test (POST)
process. When the message below appears on the screen, please <DEL> key to
enter BIOS:
Press DEL key to enter Setup Menu, F to enter Boot Menu
If the message disappears before you respond and you still need to enter BIOS,
restart the system by turning the computer OFF then back ON or pressing the
RESET button. You may also restart the system by simultaneously pressing <Ctrl>,
<Alt>, and <Delete> keys.
MSI additionally provides a method to enter the BIOS setup. You can click the
“GO2BIOS” tab on “MSI Fast Boot” utility screen to enable the system going to BIOS
setup directly at next boot.
Click "GO2BIOS" tab on "MSI Fast
Boot" utility screen.
Important
Please be sure to install the “MSI Fast Boot” utility before using it to enter the BIOS
setup.
26

Overview
After entering BIOS, the following screen is displayed.
Temperature monitor
Language
System
information
Model name
Virtual OC
Genie Button
Boot device
priority bar
English
BIOS menu
selection
BIOS menu
selection
Menu display
OC Menu
Important
•
Overclocking your PC manually is only recommended for advanced users.
•
Overclocking is not guaranteed, and if done improperly, can void your warranty or
severely damage your hardware.
•
If you are unfamiliar with overclocking, we advise you to use OC Genie for easy
overclocking.
27

▶
Current CPU/ DRAM/ Ring Frequency
These items show the current frequencies of installed CPU, Memory and Ring.
Read-only.
▶
Adjust CPU Ratio [Auto]
Sets the CPU ratio that is used to determine CPU clock speed. This item can only be
changed if the processor supports this function.
English
▶
Adjusted CPU Frequency
Shows the adjusted CPU frequency. Read-only.
▶
EIST [Enabled]
®
Enables or disables the Enhanced Intel
SpeedStep Technology. This item will be
available when "Adjust CPU Ratio" is set to [Auto].
[Enabled] Enables the EIST to adjust CPU voltage and core frequency
dynamically. It can decrease average power consumption and
average heat production.
[Disabled] Disables EIST.
▶
Intel Turbo Boost [Enabled]
®
Enables or disables the Intel
Turbo Boost. This item appears when the installed
CPU supports this function.
[Enabled] Enables this function to boost CPU performance automatically
above rated specications when system request the highest
performance state.
[Disabled] Disables this function.
▶
Adjust Ring Ratio [Auto]
Sets the ring ratio. The valid value range depends on the installed CPU.
▶
Adjusted Ring Frequency
Shows the adjusted Ring frequency. Read-only.
▶
Adjust GT Ratio [Auto]
Sets the integrated graphics ratio. The valid value range depends on the installed
CPU.
▶
Adjusted GT Frequency
Shows the adjusted integrated graphics frequency. Read-only.
▶
DRAM Frequency [Auto]
Sets the DRAM frequency. Please note the overclocking behavior is not guaranteed.
▶
Adjusted DRAM Frequency
Shows the adjusted DRAM frequency. Read-only.
2

▶
DRAM Timing Mode [Auto]
Selects the memory timing mode.
[Auto] DRAM timings will be determined based on SPD (Serial Presence
Detect) of installed memory modules.
[Link] Allows user to congure the DRAM timing manually for all memory
channel.
[UnLink] Allows user to congure the DRAM timing manually for respective
memory channel.
▶
Advanced DRAM Conguration
English
Press <Enter> to enter the sub-menu. This sub-menu will be activated after setting
[Link] or [Unlink] in “DRAM Timing Mode”. User can set the memory timing for each
memory channel. The system may become unstable or unbootable after changing
memory timing. If it occurs, please clear the CMOS data and restore the default
settings. (Refer to the Clear CMOS jumper/ button section to clear the CMOS data,
and enter the BIOS to load the default settings.)
▶
Memory Fast Boot [Auto]
Enables or disables the initiation and training for memory every booting.
[Auto] This setting will be congured automatically by BIOS.
[Enabled] Memory will completely imitate the archive of rst initiation and
rst training. After that, the memory will not be initialed and trained
when booting to accelerate the system booting time.
[Disabled] The memory will be initialed and trained every booting.
▶
DRAM Voltage [Auto]
Sets the value for appointed voltage related to memory/ PCH. If set to "Auto", BIOS
will set the voltage automatically or you can set it manually.
▶
CPU Memory Changed Detect [Enabled]
Enables or disables the system to issue a warning message during boot when the
CPU or memory has been replaced.
[Enabled] The system will issue a warning message during boot and than
needs to load the default settings for new devices.
[Disabled] Disables this function and keeps the current BIOS settings.
▶
CPU Specications
Press <Enter> to enter the sub-menu. This sub-menu displays the information of
installed CPU. You can also access this information menu at any time by pressing
[F4]. Read only.
▶
CPU Technology Support
Press <Enter> to enter the sub-menu. The sub-menu shows what the key
features does the installed CPU support. Read only.
29

▶
MEMORY-Z
Press <Enter> to enter the sub-menu. This sub-menu displays all the settings and
timings of installed memory. You can also access this information menu at any time
by pressing [F5].
▶
DIMM~2 Memory SPD
Press <Enter> to enter the sub-menu. The sub-menu displays the information of
English
installed memory. Read only.
▶
CPU Features
Press <Enter> to enter the sub-menu.
▶
Active Processor Cores [All]
This item allows you to select the number of active processor cores.
▶
Limit CPUID Maximum [Disabled]
Enables or disables the extended CPUID value.
[Enabled] BIOS will limit the maximum CPUID input value to circumvent
boot problems with older operating system that do not support
the processor with extended CPUID value.
[Disabled] Use the actual maximum CPUID input value.
▶
Execute Disable Bit [Enabled]
Intel’s Execute Disable Bit functionality can prevent certain classes of malicious
“buer overow” attacks where worms attempt to execute code to damage the
system. It is recommended that keeps this item enabled always.
[Enabled] Enables NO-Execution protection to prevent the malicious
attacks and worms.
[Disabled] Disables this function.
▶
Intel Virtualization Tech [Enabled]
Enables or disables Intel Virtualization technology.
[Enabled] Enables Intel Virtualization technology and allows a platform
to run multiple operating systems in independent partitions.
The system can function as multiple systems virtually.
[Disabled] Disables this function.
▶
Hardware Prefetcher [Enabled]
Enables or disables the hardware prefetcher (MLC Streamer prefetcher).
[Enabled] Allows the hardware prefetcher to automatically pre-fetch
data and instructions into L2 cache from memory for tuning
the CPU performance.
[Disabled] Disables the hardware prefetcher.
30

▶
Adjacent Cache Line Prefetch [Enabled]
Enables or disables the CPU hardware prefetcher (MLC Spatial prefetcher).
[Enabled] Enables adjacent cache line prefetching for reducing the
cache latency time and tuning the performance to the specic
application.
[Disabled] Enables the requested cache line only.
▶
CPU AES Instructions [Enabled]
Enables or disables the CPU AES (Advanced Encryption Standard-New
Instructions) support. This item appears when a CPU supports this function.
English
[Enabled] Enables Intel AES support.
[Disabled] Disables Intel AES support.
▶
Intel Adaptive Thermal Monitor [Enabled]
Enables or disables the Intel adaptive thermal monitor function to protect the
CPU from overheating.
[Enabled] Throttles down the CPU core clock speed when the CPU is
over the adaptive temperature.
[Disabled] Disables this function.
▶
Intel C-State [Auto]
C-state is a processor power management technology dened by ACPI.
[Auto] This setting will be congured automatically by BIOS.
[Enabled] Detects the idle state of system and reduce CPU power
consumption accordingly.
[Disabled] Disable this function.
▶
CE Support [Disabled]
Enables or disables the CE function for power-saving in halt state. This item
appears when "Intel C-State" is enabled.
[Enabled] Enables CE function to reduce the CPU frequency and
voltage for power-saving in halt state.
[Disabled] Disables this function.
▶
Package C State limit [Auto]
This item allows you to select a CPU C-state mode for power-saving when
system is idle. This item appears when "Intel C-State" is enabled.
[Auto] This setting will be congured automatically by BIOS.
[C0~C7s] The power-saving level from high to low is C7s, C7, C6, C3,
C2, then C0.
3

▶
LakeTiny Feature [Disabled]
Enables or disables Intel Lake Tiny feature with iRST for SSD. This item appears
when a installed CPU supports this function and "Intel C-State" is enabled.
[Enabled] Enhance the dynamic IO load adjusted performance for
accelerating the SSD speed.
[Disabled] Disables this feature.
English
Note: The following items will appear when "Intel Turbo Boost " is enabled.
▶
Long Duration Power Limit (W) [Auto]
Sets the long duration TDP power limit for CPU in Turbo Boost mode.
▶
Long Duration Maintained (s) [Auto]
Sets the maintaining time for "Long duration power Limit(W)".
▶
Short Duration Power Limit (W) [Auto]
Sets the short duration TDP power limit for CPU in Turbo Boost mode.
▶
CPU Current limit (A) [Auto]
Sets maximum current limit of CPU package in Turbo Boost mode. When the
current is over the specied limit value, the CPU will automatically reduce the
core frequency for reducing the current.
▶
/2/3/4-Core Ratio Limit [Auto]
These items allow you to set the CPU ratios for dierent number of active cores
in turbo boost mode. These items appear when the installed processor supports
this function.
32